L40 半导体分立器件综合 标准查询与下载

DIN EN 60749-39:2007 半导体器件.机械和气候试验方法.第39部分:测量用于半导体元件的有机材料的湿气扩散性和水溶解性

This part of DIN EN 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006

DIN EN 60749-26:2007 半导体器件.机械和气候试验方法.第26部分:静电放电(ESD)灵敏度试验.人体模型(HBM)

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2006); German version EN 60749-26:2006

BS EN 60749-39:2006 半导体器件.机械和气候试验方法.半导体器件用有机材料湿气扩散性和水溶解性的测量

This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

KS C IEC 60749-39:2006 半导体器件.机械和气候试验方法.第39部分:半导体器件使用的有机材料湿气扩散性和水溶解性的测量

이 규격은 반도체 부품 패키징에 사용되는 유기 재료의 수분 확산도(moisture diff

Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

GJB 5914-2006 各种质量等级军用半导体器件破坏性物理分析方法

本标准规定了GJB/Z 299B-1998 《电子设备可靠性预计手册》中所包括的各种军用质量等级半导体器件破坏性物理分析（DPA）方法，包括DPA程序的一般要求以及不同质量等级半导体器件DPA试验与分析的通用方法和缺陷判据。 本标准适用于有DPA要求的各种军用质量等级的半导体器件。

Methodsof destructive physical analysis for military semiconductor devices of all kinds of quality class

NF C96-022-27*NF EN 60749-27:2006 半导体装置.机械和气候试验方法.第27部分:静电放电(ESD)灵敏度测试.机器模型(MM)

Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM).

NF C96-022-26:2006 半导体装置.机械和气候试验方法.第26部分:静电放电(ESD)灵敏度测试.人体模型(HBM)

Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM).

JEITA ED7500A-2-2006 半导体装置的尺寸标准(个别半导体装置)

This standard stipulates outline drawings of discrete semiconductor devices.

Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

DIN V VDE V 0884-10:2006 半导体器件.可靠绝缘的磁性电容耦合器

Semiconductor devices - Magnetic and capacitive couplers for safe isolation

KS C IEC 60749-16:2006 半导体器件.机械和气候试验方法.第16部分:粒子冲击噪声探测(PIND)

이 규격의 목적은 공동 소자 내부에 세라믹 칩, 본딩 와이어 조각 또는 솔더볼과 같은 떨어

Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)

KS C IEC 60749-17:2006 半导体器件.机械和气候试验方法.第17部分:中子辐照

중성자 방사 시험은 중성자 환경에서 열화에 따른 반도체 소자의 내성(susceptibili

Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation

KS C IEC 60749-1:2006 半导体器件.机械和气候试验方法.第1部分:总则

이 규격은 반도체 소자(개별 소자 및 집적 회로)에 적용 가능하며, IEC 60749 시리

Semiconductor devices－Mechanical and climatic test methods－Part 1：General

KS C IEC 60749-32:2006 半导体器件.机械和气候试验方法.第32部分:塑料密封器件的易燃性(外部感应)

이 규격은 반도체 소자(개별 소자 및 직접 회로)에 적용 가능하다.이 시험의 목적은 과

Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)

KS C IEC 60749-8:2006 半导体器件.机械和气候试验方法.第8部分:密封

이 규격은 반도체 소자(개별 소자, 집적 회로)에 적용 가능하다.이 시험 방법의 목적은

Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing

BS EN 62258-5:2006 半导体压模制品.关于电子模拟的信息要求

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers; – singulated bare die; – die and wafers with attached connection structures; – minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

Semiconductor die products - Requirements for information concerning electrical simulation

BS EN 60749-35:2006 半导体器件.机械和气候试验方法.塑封电子器件的声学显微方法

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components

KS C IEC 60749-31:2006 半导体器件.机械和气候试验方法.第31部分:塑料密封器件的易燃性(内部感应)

이 규격은 반도체 소자(개별 소자 및 집적 회로)에 적용 가능하다.이 시험의 목적은 과

Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of plastic-encapsulated devices(internally induced)

BS EN 62258-6:2006 半导体压模制品.关于热模拟的信息要求

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

Semiconductor die products - Requirements for information concerning thermal simulation

BS EN 62047-2:2006 半导体器件.微型机电器件.薄膜材料的拉伸试验方法

This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

KS C IEC 60749-14:2006 半导体器件.机械和气候试验方法.第14部分:终端装置的坚固性(引线牢固性)

이 규격은 리드/패키지의 인터페이스 그리고 결점이 있는 기판을 재조립할 때 따라오는 리드를

Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)