L58 混合集成电路 标准查询与下载

SJ/T 10456-1993 混合集成电路用被釉钢基片

本标准适用于以低碳钢、不锈钢等金属为芯板、表面被覆一层瓷釉的混合集成电路用被釉钢基片。

Porcelain enameled steel substrate for hybrid integrated circuits

SJ/T 10454-1993 厚膜混合集成电路多层布线用介质浆料

本标准适用于与金、钯银导体浆料相匹配的厚膜混合集成电路多层布线用介质浆料。

Dielectric paste for multilayer lay out of thick film hybrid integrated circuits

CECC MUAHAG VOL 13 IS 2-1993 首选产品列表.伺服组件 (En)

Preferred Products List; Servo Components (En)

Preferred Products List; Servo Components (En)

DLA SMD-5962-90631-1992 14位模拟数字转变器,线性混合微型电路

STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS CHECKED BY c fi;

MICROCIRCUIT, LINEAR, ANALOG TO DIGITAL CONVERTER, 14-BIT, HYBRID

DLA SMD-5962-92304-1992 MIL-STD-1553多路复用总线远程终端,混合数字微型电路

ihis drawing forms 9 pePt pf B One piirt - ow part nyi9ber d?syu!enfatiop Systr~ !see 6,s kepgjri). This drayinq describe* daviti13 requirements faF hybrid Micrscircr(its to be prsgesjsd In %csafd~+pg!, with H&-!j-Jijig#.

MICROCIRCUIT, DIGITAL, MIL-STD-1553, MUX BUS REMOTE TERMINAL, HYBRID

EN 163100:1991 分规范.薄膜集成电路和混合集成电路

Sectional specification: film and hybrid integrated circuits

EN 163101:1991 空白详细规范.薄膜集成电路和混合集成电路

Blank detail specification: film and hybrid integrated circuits

SJ/T 10193-1991 QF1076型信号发生器.技术条件

本标准规定了QF 1076型信号发生器的技术要求、测试方法和检验规则等。 本标准适用于QF 1076型信号发生器。

Specifications for signal generator for Type QF1076

SJ/T 10243-1991 微波集成电路用氧化铝陶瓷基片

本标准规定了微波集成电路用氧化铝陶瓷基片的结构尺寸、技术要求、试验方法、检验规则、标志、包装、运输、贮存。 本标准适用于微波集成电路用氧化铝陶瓷基片。

Alumina ceramic substrates for microwave integrated circuits

DLA SMD-5962-89565 REV A-1991 精确取样保持双重8通道多路复用器的线性混合微型电路

THIS DRAWING IS AVAILABLE 3RUSEBYALLDEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA DEFENSE ELECTRONICS SUPPLY CENTER MICROCIRCUIT, LINEAR, DUAL 8-CHANNEL MULTIPLEXER WITH PRECISION SAMPLE AND 9

MICROCIRCUIT, LINEAR, DUAL 8-CHANNEL MULTIPLEXER WITH PRECISION SAMPLE AND HOLD, HYBRID

SJ/T 10156-1991 电子元器件详细规范.混合厚膜集成电路HM0111、HM0114电源误差放大电路

本规范规定了混合厚膜集成电路HM0111、HM0114电源误差放大电路的鉴定和质量评定的全部内容。

Detail specification for electronic components--Case rated silicon rectifier diode,Type 2CZ59

SJ/T 10155-1991 电子元器件详细规范.混合厚膜集成电路HM0006伴音耦合电路

本规范规定了混合厚膜集成电路HM0006伴音耦合电路的鉴定和质量评定的全部内容。

Detail specification for electronic components--Case rated silicon rectifier diode,Type 2CZ58

SJ/T 10153-1991 电子元器件详细规范.混合厚膜集成电路HM0004、HM0190视频输出电路

本规范规定了混合厚膜集成电路HM0004、HM0190视频输出电路的鉴定和质量评定的全都内容。

Detail specification for electronic components--Silicon NPN case rated bipolar transistor for low-frequency amplification for Type 3DD313

BS CECC 63000:1990 电子元器件用质量评估协调体系.一般规范:薄膜和混合式集成电路

Defines procedures and methods for testing and states requirements for the release of products using either qualification approval or capability approval procedures.

Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits

IEC 60748-11:1990 半导体器件 集成电路 第11部分:半导体集成电路(不包括混合电路)分规范

本份规范适用于已封装的半导体集成电路， 包括多片集成电路， 但不包括混合电路。

Semiconductor devices; integrated circuits; part 11: sectional specification for semiconductor integrated circuits excluding hybrid circuits

CECC MUAHAG VOL 12 IS 1-1990 首选产品列表.微波组件 (En, Fr, Ge)

Preferred Products List; Microwave Components (En, Fr, Ge)

Preferred Products List; Microwave Components (En, Fr, Ge)

SJ 2905-1988 电子元器件详细规范.厚膜混合集成电路CHM9102电压设定电路

Detail specification for electronic components--Voltage established circuits for type CHM9102 of hybrid thick-film integrated circuits

SJ 2906-1988 电子元器件详细规范.厚膜混合集成电路CHM7103高压限制电路

Detail specification for electronic components--High voltage limiting circuits for type CHM7103 of hybrid thick-film integrated circuits

SJ 2903-1988 电子元器件详细规范.厚膜混合集成电路CHM8546视放电路

Detail specification for electronic components--Video amplifiers for type CHM8546 of hybrid thick-film integrated circuits

SJ 2904-1988 电子元器件详细规范.厚膜混合集成电路CHM6232、CHM6236帧输出电路

Detail specification for electronic components--Frame output circuits for type CHM6232 and CHM6236 of hybrid thick-film integrated circuits