L58 混合集成电路 标准查询与下载

DIN 45941-11:1987 电子元件质量评定协调体系.分规范:混合集成电路和薄膜集成电路(性能检验)(CECC63200)

Harmonized system of quality assessment for electronic components; sectional specification: film and hybrid integrated circuits (capability approval)

NF C86-414:1987 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路路.功能认可..空白详细规范

SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 201).

NF C86-413:1987 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.功能认可.分规范

SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 200).

NF C86-412:1987 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.空白详细规范

SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 101).

NF C86-411:1987 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.分规范

SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 100).

NF C96-405:1986 薄模和混合式集成电路.密封外壳

Film and hybrid integrated circuits. Hermetic packages.

ECA 513-1986 EIA/NARM标准:电路印制板安装的Low Profile中继

This standard applies to armature-type, circuit-board-mounted relays permitting board center spacings of less than 1 inch.These relays generally are classed in the load range of O to 2 amperes. This document is intended to help define standard packages, f

EIA/NARM Standard Low Profile Relays for Circuit Board Mounting

SJ 2481-1984 混合集成电路模拟.数字转换器静态测试方法的基本原理

本标准规定了混合集成电路模拟一数字转换器的静态测试方法的基本原理。

General principles of static measurement for A/D converters for hybrid integrated circuits

SJ 2480-1984 混合集成电路数字.模拟转换器静态测试方法的基本原理

本标准规定了混合集成电路数字-模拟转换器的静态测试方法的基本原理。

General principles of static measurement for D/A converters for hybrid integrated circuits

SJ 2482-1984 混合集成电路模拟.数字转换器系列和品种

1.1 本标准规定了混合集成电路模拟-数字转换器的系列和品种。系列按电路主要特性不同划分，计有通用、高性能、高速、超高速、高分辨力、低功耗六个系列。各系列的品种按代码、分辨力和速度划分。 1.2 生产单位生产(试制)和使用单位选用ADC时，其系列和品种应符合本标准的规定。 1.3 本标准所列电路采用卧式(或双列直插式)金属、陶瓷外壳封装。电路的封装形式和外形尺寸见附录A。 1.4 本标准列出的系列和品种代号作为电路型号的主要部分，表示器件的主称、电路类型和品种代号。

Series and types of D/A converters for hybrid integrated circuits

SJ 2483-1984 混合集成电路数字.模拟转换器系列和品种

1.1 本标准规定了混合集成电路模拟-数字转换器的系列和品种。系列按电路主要特性不同划分，计有通用、高性能、高速、超高速、高分辨力、低功耗六个系列。各系列的品种按代码、分辨力和速度划分。 1.2 生产单位生产(试制)和使用单位选用ADC时，其系列和品种应符合本标准的规定。 1.3 本标准所列电路采用卧式(或双列直插式)金属、陶瓷外壳封装。电路的封装形式和外形尺寸见附录A。 1.4 本标准列出的系列和品种代号作为电路型号的主要部分，表示器件的主称、电路类型和品种代号。 

Series and types of A/D converters for hybrid integrated circuits

AIA/NAS NAS 3450-1983 (Rev. 2)硅单块集成电路未加外壳装置

Uncased Devices (Silicon Monolithic) (Rev. 2)

Uncased Devices (Silicon Monolithic) (Rev. 2)

SJ 2231-1982 厚膜、薄膜集成电路直流稳压电源系列和品种

Series and types of direct current voltage regulators for thick-film and thin-film integrated circuits

ECA 436-1977 电路板安装的干簧继电器的EIA/NARM标准

This standard applies to circuit board mounted ielays that utilize magnetically actuated dry reed switches to perform the switching function. This document is intended to help standardize dry reed relay packaging,testing, and rating methods. If this stand

Dry Reed Relays for Circuit Board Mounting

ECA 406-1974 连接器,电器,油漆电路板IPC-C-405A的一般文件

This standard is the result of a cooperative effort with members of the Institute of Printed Circuits (IPC) Connector Committee and the Electronic Industries Association (EIA) Committee P-5.1 on Connectors.

General Document for Connectors, Electric, Printed-Wiring Board IPC-C-405A

ECA CB 2-1959 印制电路板的污染

For the purpose of this paper, contamination will be defined as a chemical or metallurgical material change or deterioration on the board., occurring before or after assembly. These c,hangessmaya rise in (a) the raw material, (b) processing or '(c) fro

Contamination of Printed Wiring Boards

ECA 216-1959 印制电路粘连标准测试方法

This Standard is intended for determining the following characteristics of printed wiring boards: (a)resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of conductors at standard room temperat

Adhesion of Printed Wiring, Method of Test for

ECA 208-1958 定义和注册,印制电路

Definition and register of all forms of printed wiring are included. “Definition” is the degree of faithfulness of reproduction of conductor referred to the Master Pattern. “Register” is the degree of alignment of conductor with intended position on the p

Definition and Register, Printed Wiring

ECA 213-1958 印制电路组件的测试点定位

This standard establishes systems of preferred locations for test points on printed wiring assemblies.

Test Point Locations for Printed Wiring Assemblies

ECA 161-1956 陶瓷印制电路板的测试标准

These Unit Standards give physical and electrical specifications of Ceramic Based Printed Circuits which have the physical specifications include maximum overail size, lead length and size, lead number and sequence, EIA been standardized. These units are

Ceramic Based Printed Circuits, Unit Standards for