产品描述
产品描述 EVG®850 TB临时键合机 Features Open adhesive platform Various carriers (silicon, glass, sapphire, etc…) Bridge tool capability for different substrate sizes Available with multiple load port options and combinations Recipe controlled system Real time monitoring and recording of all relevant process parameters Fully integrated SECS/GEM interface Optional integrated inline metrology module for automated feedback loop Technical Data Warped wafer handling EVG®850 DB 解键合机 Features Reliable handling of thinned, bowed and warped wafers with and without topography Automated cleaning of debonded wafer Recipe controlled system Real time monitoring and recording of all relevant process parameters Fully integrated SECS/GEM interface in automated tools Bridge tool capability for different substrate sizes Modular tool layout → throughput-optimized depending on specific process Technical DataWafer diameter (substrate size) Up to 300 mm, oversized carrier possible Different substrate / carrier combinations Configuration Coat module Bake module with multiple hot plates Align module with optical or mechanical alignment Bond module Options Inline Metrology ID reading High topography wafer handling 
