产品描述
产品描述 Features Unique pressure and temperature uniformity Compatible with EVG mechanical and optical aligners Flexible design and configurations for research and piloting Form single chips to wafers Various processes (eutectic, solder, TLP, direct bonding) Optional turbopump (<1E-5 mbar) Upgradeable for anodic bonding Open chamber design for easy conversion and maintenance Production compatible High throughput with fast heating and pumping specifications High yield through automatic wedge compensation Open chamber design for fast conversion and maintenance Smallest footprint for a 200 mm bonding system: 0.8 m2 Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems Technical DataMax contact force 10, 20, 60 kN Heater size 150 mm 200 mm Minimum substrate dimension single chips 100 mm Vacuum Standard: 0.1 mbar Optional: 1E-5 mbar Max. temperature Standard: 550 °C Optional: 650 °C Single chips processing Yes Bond chuck system / Alignment system 150 mm heater: EVG®610, EVG®620, EVG®6200 200 mm heater: EVG®6200, SmartView® NT Active water cooling For bottom side Power supply for anodic bonding Max. voltage: 2 kV Max. current: 50 mA Loading chamber Manual 
