EIA SP07-DSEG93-1994
元件可焊性指导

COMPONENT SOLDERABILITY GUIDE

EIA SP07-DSEG93-1994 发布历史

Solderability of component leads, wire, terminals, and printed wiring boards (PFvBs) is a prerequisite for assembly solderability. While that may appear obvious, solder defects caused by poor solderability always have been common, so much so that many production people regard such defects as inevitable. While the solderability is rarely bad enough to threaten the integrity of the connection,1.2 military soldering specifications3 often require that each connection be inspected for defects and that those found be reworked. Not only is it expensive to look for defects, but rework poses a threat of damage, particularly to boards. The process used to solder, or rework, a connection is limited in its ability to overcome poor solderability, whether that process uses a soldering iron or the latest automated machine

EIA SP07-DSEG93-1994由(美国)电子工业联合会 US-EIA 发布于 1994-02-04。

EIA SP07-DSEG93-1994 在中国标准分类中归属于: L24 安装、接线连接件，在国际标准分类中归属于: 49.025.01 航空航天制造用材料综合。

EIA SP07-DSEG93-1994的历代版本如下：

• 1994年02月04日 EIA SP07-DSEG93-1994 元件可焊性指导

非常抱歉，我们暂时无法提供预览，您可以试试： 免费下载 EIA SP07-DSEG93-1994 前三页，或者稍后再访问。

注意： 点击下载后，生成下载文件时间比较长，请耐心等待......

标准号

EIA SP07-DSEG93-1994

发布日期

1994年02月04日

实施日期

废止日期

无

中国标准分类号

L24

国际标准分类号

49.025.01

发布单位

US-EIA

适用范围

Solderability of component leads, wire, terminals, and printed wiring boards (PFvBs) is a prerequisite for assembly solderability. While that may appear obvious, solder defects caused by poor solderability always have been common, so much so that many production people regard such defects as inevitable. While the solderability is rarely bad enough to threaten the integrity of the connection,1.2 military soldering specifications3 often require that each connection be inspected for defects and that those found be reworked. Not only is it expensive to look for defects, but rework poses a threat of damage, particularly to boards. The process used to solder, or rework, a connection is limited in its ability to overcome poor solderability, whether that process uses a soldering iron or the latest automated machine