EIA SP07-DSEG93-1994
元件可焊性指导

COMPONENT SOLDERABILITY GUIDE


 

 

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标准号
EIA SP07-DSEG93-1994
发布
1994年
发布单位
(美国)电子工业联合会
当前最新
EIA SP07-DSEG93-1994
 
 
适用范围
Solderability of component leads, wire, terminals, and printed wiring boards (PFvBs) is a prerequisite for assembly solderability. While that may appear obvious, solder defects caused by poor solderability always have been common, so much so that many production people regard such defects as inevitable. While the solderability is rarely bad enough to threaten the integrity of the connection,1.2 military soldering specifications3 often require that each connection be inspected for defects and that those found be reworked. Not only is it expensive to look for defects, but rework poses a threat of damage, particularly to boards. The process used to solder, or rework, a connection is limited in its ability to overcome poor solderability, whether that process uses a soldering iron or the latest automated machine

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