This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole@ through-hole mounting technology (THT)@ or the THT portions of those assemblies that include other related technologies (i.e. surface mount@ chip mounting@ terminal mounting).
61191-3-1998由IEC - International Electrotechnical Commission 发布于 1998-08-01,并于 2017-05-31 实施。
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