61191-3-1998 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies (Edition 1.0)
Ensembles De Cartes Imprimees - Partie 3: Specification Intermediaire - Exigences Relatives A L?Assemblage Par Brasage De Trous Traversants (Edition 1.0)
This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole@ through-hole mounting technology (THT)@ or the THT portions of those assemblies that include other related technologies (i.e. surface mount@ chip mounting@ terminal mounting).