What is BS IEC 63011-3 about?
BS IEC 63011-3 is the third part of the BS IEC 63011 series of standards that specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Note: 3-D IC specifications covered by BS IEC 63011-3 are the following:
Application: digital consumer and mobile;
Aperating voltage: 0,1 V to 5,0 V,
Operating frequency: less than 2,0 GHz
Note: BS IEC 63011-3 does not describe the equipment for the measurement.
Who is BS IEC 63011-3 for?
BS IEC 63011-3 ...