GSO IEC 61189-5-3:2021
电气材料、印制板和其他互连结构和组件的测试方法 第5-3部分：材料和组件的通用测试方法 印制板组件的焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

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标准号

GSO IEC 61189-5-3:2021

发布

2021年

发布单位

GSO

当前最新

GSO IEC 61189-5-3:2021

 

 

适用范围

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.

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