BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect

BS IEC 63011-2:2018 发布历史

What is BS IEC 63011-2 about?    BS IEC 63011-2 is the second part of the BS IEC 63011 series of standards that provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys.    Note: These specifications apply only if the electrical coupling method of die-to-die alignment is used in the die stacking.  Who is BS IEC 63011-2 for?   BS IEC 63011-2 on stack dies is useful for:   Integrated circuits manufacturers  

BS IEC 63011-2:2018由英国标准学会 GB-BSI 发布于 2019-01-31，并于 2019-01-31 实施。

BS IEC 63011-2:2018在国际标准分类中归属于: 31.200 集成电路、微电子学。

BS IEC 63011-2:2018的历代版本如下：

• 2019年 BS IEC 63011-2:2018

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标准号

BS IEC 63011-2:2018

发布

2019年

发布单位

英国标准学会

当前最新

BS IEC 63011-2:2018

 

 

适用范围

What is BS IEC 63011-2 about?    BS IEC 63011-2 is the second part of the BS IEC 63011 series of standards that provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys.    Note: These specifications apply only if the electrical coupling method of die-to-die alignment is used in the die stacking.  Who is BS IEC 63011-2 for?   BS IEC 63011-2 on stack dies is useful for:   Integrated circuits manufacturers  

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