Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for thermal property measurements of metalized ceramic substrates - Evaluation of thermal resistance for use in power modules
1 Scope
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate , imitating a silicon carbide (SiC) high-output power module. This measurement represents
an index of the heat dissipation characteristics of a metallized ceramic substrate
used in a high-output power module.