IEC 61249-5-1-1995
互连结构用材料 第5部分:有或无涂层的导电箔和薄膜分规范集 第1节:铜箔(用于生产覆铜基材)
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)