This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or crosslinking. This standard does not relate to reactive compounds used as coating powders.
NOTE - It is intended to draw up specifications for coating powders as a separate IEC Standard having a different number.
These materials may be used for a range of applications, of which common ones are shown in table 1.
The code letters associated with the application may be used as abbreviation of the application description. Further applications and associated code letters may be added if so required.