IEC 60455-1-1998
电气绝缘用无溶剂可聚合树脂 第1部分:定义和一般要求

Resin based reactive compounds used for electrical insulation - Part 1: Definitions and general requirements

IEC 60455-1-1998 发布历史

This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or crosslinking. This standard does not relate to reactive compounds used as coating powders. NOTE - It is intended to draw up specifications for coating powders as a separate IEC Standard having a different number. These materials may be used for a range of applications, of which common ones are shown in table 1. The code letters associated with the application may be used as abbreviation of the application description. Further applications and associated code letters may be added if so required.

IEC 60455-1-1998由国际电工委员会 IX-IEC 发布于 1998-08。

IEC 60455-1-1998 在中国标准分类中归属于: K15 电工绝缘材料及其制品，在国际标准分类中归属于: 01.040.29 电气工程 (词汇),29.035.20 塑料和橡胶绝缘材料。

IEC 60455-1-1998的历代版本如下：

• 1974年 IEC 60455-1-1974 电气绝缘用无溶剂可聚合树脂化合物规范.第1部分:定义和一般要求
• 1998年08月 IEC 60455-1-1998 电气绝缘用无溶剂可聚合树脂 第1部分:定义和一般要求

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标准号

IEC 60455-1-1998

发布日期

1998年08月

实施日期

废止日期

无

中国标准分类号

K15

国际标准分类号

01.040.29;29.035.20

发布单位

IX-IEC

被代替标准

IEC 15C/969/FDIS-1998 IEC 60455-1-1974 IEC 60455-1A-1980

适用范围

This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or crosslinking. This standard does not relate to reactive compounds used as coating powders. NOTE - It is intended to draw up specifications for coating powders as a separate IEC Standard having a different number. These materials may be used for a range of applications, of which common ones are shown in table 1. The code letters associated with the application may be used as abbreviation of the application description. Further applications and associated code letters may be added if so required.

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