IEC 60068-2-58-1999
环境试验 第2-58部分:试验 试验Td:表面安装元器件用可焊性、耐金属化溶融和耐焊接热试验方法
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)