IEC 62258-5:2006
半导体压模产品.第5部分:关于电子模拟的信息要求
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
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- 标准号
- IEC 62258-5:2006
- 发布
- 2006年
- 发布单位
- 国际电工委员会
- 当前最新
- IEC 62258-5:2006
- 被代替标准
- IEC 47/1869/FDIS:2006
- 适用范围
- This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers; – singulated bare die; – die and wafers with attached connection structures; – minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.