IEC 62258-5-2006
半导体压模产品.第5部分:关于电子模拟的信息要求

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation


IEC 62258-5-2006 发布历史

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers; – singulated bare die; – die and wafers with attached connection structures; – minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

IEC 62258-5-2006由国际电工委员会 IX-IEC 发布于 2006-08。

IEC 62258-5-2006 在中国标准分类中归属于: L55 微电路综合,在国际标准分类中归属于: 31.080.99 其他半导体分立器件,31.200 集成电路、微电子学。

IEC 62258-5-2006的历代版本如下:

  • 2006年08月 IEC 62258-5-2006 半导体压模产品.第5部分:关于电子模拟的信息要求

 

 

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标准号
IEC 62258-5-2006
发布日期
2006年08月
实施日期
废止日期
中国标准分类号
L55
国际标准分类号
31.080.99;31.200
发布单位
IX-IEC
被代替标准
IEC 47/1869/FDIS-2006
适用范围
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers; – singulated bare die; – die and wafers with attached connection structures; – minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

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