This part of IEC 60286 is applicable to the (ape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
IEC 60286-3-2007由国际电工委员会 IX-IEC 发布于 2007-06。
IEC 60286-3-2007 在中国标准分类中归属于: L08 标志、包装、运输、贮存,在国际标准分类中归属于: 31.020 电子元器件综合,55.060 卷轴、线轴。
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