JEDEC JEP144-2002
微电子封装剩余气体分析(RGA)指南

Guideline for Residual Gas Analysis (RGA) for Microelectronic Packages

JEDEC JEP144-2002 发布历史

This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. A compendium of references to reports, papers, and texts, relating to RGA, volatile gasses, and sealed packages is included in Annex D.

JEDEC JEP144-2002由(美国)固态技术协会,隶属EIA US-JEDEC 发布于 2002-07-01。

JEDEC JEP144-2002 在中国标准分类中归属于: L56 半导体集成电路。

JEDEC JEP144-2002的历代版本如下：

• 2002年07月01日 JEDEC JEP144-2002 微电子封装剩余气体分析(RGA)指南

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标准号

JEDEC JEP144-2002

发布日期

2002年07月01日

实施日期

废止日期

无

中国标准分类号

L56

发布单位

US-JEDEC

适用范围

This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. A compendium of references to reports, papers, and texts, relating to RGA, volatile gasses, and sealed packages is included in Annex D.