The use of faster logic switching speeds and higher levels of integrated circuit functional integration are placing new demands on digital system interconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end-product development, fabrication, assembly, testing, and maintenance purposes.
IPC D-330 SECTION 10-1992由美国电子电路和电子互连行业协会 US-IPC 发布于 1992-01-01。
IPC D-330 SECTION 10-1992 在中国标准分类中归属于: L10 电子元件综合,在国际标准分类中归属于: 31.190 电子元器件组件。
非常抱歉,我们暂时无法提供预览,您可以试试: 免费下载 IPC D-330 SECTION 10-1992 前三页,或者稍后再访问。
点击下载后,生成下载文件时间比较长,请耐心等待......
Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号