IPC D-330 SECTION 10-1992
第10章印制电路板背板设计

Section Ten Printed Board Backplane Design


IPC D-330 SECTION 10-1992 发布历史

The use of faster logic switching speeds and higher levels of integrated circuit functional integration are placing new demands on digital system interconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end-product development, fabrication, assembly, testing, and maintenance purposes.

IPC D-330 SECTION 10-1992由美国电子电路和电子互连行业协会 US-IPC 发布于 1992-01-01。

IPC D-330 SECTION 10-1992 在中国标准分类中归属于: L10 电子元件综合,在国际标准分类中归属于: 31.190 电子元器件组件。

IPC D-330 SECTION 10-1992的历代版本如下:

 

 

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标准号
IPC D-330 SECTION 10-1992
发布日期
1992年01月01日
实施日期
废止日期
中国标准分类号
L10
国际标准分类号
31.190
发布单位
US-IPC
适用范围
The use of faster logic switching speeds and higher levels of integrated circuit functional integration are placing new demands on digital system interconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end-product development, fabrication, assembly, testing, and maintenance purposes.




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