IEC 60749-19 Edition 1.1-2010
半导体器件.机械和气候试验方法.第19部分:模剪切强度

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

IEC 60749-19 Edition 1.1-2010 发布历史

This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. NOTE 1 This determination is based on a measure of the force applied to the die or to the element, and, if a failure occurs, the type of failure resulting from the application of force and the visual appearance of the residual die attach medium and the header/substrate metallization. NOTE 2 In cavity packages, die shear strength is measured in order to assure the strength of the die attachment within the cavity. In non-cavity packages, such as plastic encapsulated packages, die bonding is used to prevent die movement until the resin mould is completely cured. Normally, specification of the die shear strength and the minimum adhesion area of die bond after moulding are unnecessary, except in the following circumstances: – when the die needs to be electrically connected to die pad; – when heat from the die needs to be diffused through the die bond.

IEC 60749-19 Edition 1.1-2010由国际电工委员会 IX-IEC 发布于 2010-11-01，并于 2010-11-01 实施。

IEC 60749-19 Edition 1.1-2010 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080.01 半导体器分立件综合。

IEC 60749-19 Edition 1.1-2010的历代版本如下：

• 2010年11月01日 IEC 60749-19 Edition 1.1-2010 半导体器件.机械和气候试验方法.第19部分:模剪切强度

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标准号

IEC 60749-19 Edition 1.1-2010

发布日期

2010年11月01日

实施日期

2010年11月01日

废止日期

无

中国标准分类号

L40

国际标准分类号

31.080.01

发布单位

IX-IEC

适用范围

This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. NOTE 1 This determination is based on a measure of the force applied to the die or to the element, and, if a failure occurs, the type of failure resulting from the application of force and the visual appearance of the residual die attach medium and the header/substrate metallization. NOTE 2 In cavity packages, die shear strength is measured in order to assure the strength of the die attachment within the cavity. In non-cavity packages, such as plastic encapsulated packages, die bonding is used to prevent die movement until the resin mould is completely cured. Normally, specification of the die shear strength and the minimum adhesion area of die bond after moulding are unnecessary, except in the following circumstances: – when the die needs to be electrically connected to die pad; – when heat from the die needs to be diffused through the die bond.