IEC 62258-1-2005
半导体压模产品.第1部分:采购和使用的要求

Semiconductor die products - Part 1: Requirements for procurement and use

IEC 62258-1-2005 发布历史

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. This standard covers the specific requirements for data needed to describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also contains, in Annexes A and B, terminology and a list of common acronyms, respectively.

IEC 62258-1-2005由国际电工委员会 IX-IEC 发布于 2005-08。

IEC 62258-1-2005 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080.01 半导体器分立件综合。

IEC 62258-1-2005的历代版本如下：

• 2005年08月 IEC 62258-1-2005 半导体压模产品.第1部分:采购和使用的要求
• 2009年04月 IEC 62258-1-2009 半导体压模产品.第1部分:采购和使用

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标准号

IEC 62258-1-2005

发布日期

2005年08月

实施日期

废止日期

无

中国标准分类号

L40

国际标准分类号

31.080.01

发布单位

IX-IEC

代替标准

IEC 62258-1-2009

适用范围

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. This standard covers the specific requirements for data needed to describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also contains, in Annexes A and B, terminology and a list of common acronyms, respectively.

IEC 62258-1-2005系列标准

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