IEC 63055:2016
大规模集成电路(LSI)封装电路板互操作设计格式
Format for LSI-Package-Board interoperable design
- 标准号
- IEC 63055:2016
- 发布
- 2016年
- 发布单位
- 国际电工委员会
- 当前最新
- IEC 63055:2016
- 引用标准
- IEEE 1364:2005
- 被代替标准
- IEC 91/1362/FDIS:2016
- 适用范围
- This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI)@ b) packages for such LSI@ and c) printed circuit boards on which the packaged LSI are interconnected. Collectively@ such designs are referred to as?? LSI-Package-Board?? (LPB) designs. The format provides a common way to specify information/data about the project management@ netlists@ components@ design rules@ and geometries used in LPB designs