31.020 电子元器件综合 标准查询与下载

JIS C 5062:2008 电阻器和电容器的标记代码

This Standard specifies marking codes for resistors and capacitors and indexes for the dielectric material of plastic film capacitors. a) The code specified in clause 3 gives a colour coding for fixed resistors. It is intended for use with the values of the E6 to E192 series as specified in JIS C 5063. b) The code specified in clause 4 gives a system for marking resistance and capaci- tance values by means of letters and digits. c) The code specified in clause 5 gives a system for marking the tolerance on resis- tance and capacitance values by means of a letter. d) The code specified in clause 6 gives systems for marking the date codes on capaci- tors and resistors by means of letters and digits. e) The code (index) specified in clause 7 gives a coding system for the dielectric ma- terial. NOTE : The International Standard corresponding to this Standard is as follows. IEC 60062:2004 Marking codes for resistors and capacitors (MOD) In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21.

Marking codes for resistors and capacitors

JJF 1202-2008 驻极体传声器校准规范

本规范适用于校准用驻极体传声器的校准。

Calibration Specification for Electret Microphones

DS/EN 60286-3:2008 自动处理元件的包装 第3部分：连续带上表面贴装元件的包装

Relates to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. Includes only those dimensions which are essential for the taping of components for the above-mentioned purposes.

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

DS/EN 61340-5-1:2008 静电 第 5-1 部分：保护电子设备免受静电现象影响 一般要求

This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment susceptible to damage by electrostatic discharges greater than or equal to 100 V human body model (HBM).This standard provides the requirements for an ESD control program. The user should refer to IEC 61340-5-2 for guidance on the implementation of this standard.This standard does not apply to electrically initiated explosive devices, flammable liquids, gases and powders.The purpose of this standard is to provide the administrative and techni

Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

DIN EN 62137-1-1:2008 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-1部分:拉拔强度试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007

DIN EN 62137-1-2:2008 表面安装技术.表面装配的焊接接缝的环境和耐久性试验方法.第1-2部分:切变强度试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007); German version EN 62137-1-2:2007

ANSI/EIA 468-C:2008 自动处理用径向结构元件的引线用带系扎

Provide dimensions and tolerances necessary to lead tape components in the radial format (unidirectional leads) such that they may be automatically handled.

Lead Taping of Components in the Radial Configuration for Automatic Handling

ANSI/VITA 51.0-2008 可靠性预测

This document provides an electronics failure rate predicition methodology and self assessment standard.

Reliability Prediction

ANSI/EIA 481-D:2008 自动操作用表面安装元件的8mm～200mm压纹载带和8mm与12mm穿孔载带

Covers requirements for taping surface mount components.

8 mm through 200 mm Embossed Carrier Taping and 8 mm &12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling

DS/EN 61760-2:2007 表面贴装技术 第2部分：表面贴装器件（SMD）的运输和储存条件 应用指南

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and ”popcorning”.

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

ITU-T L.204-2007 管理外部设备中的有源电子设备

Managing active electronics in the outside plant

BS EN 62137-1-1:2007 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.拉拔强度试验

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Pull strength test

BS EN 62137-1-2:2007 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.剪切强度试验

The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Shear strength test

LST EN 61760-2-2007 表面贴装技术 第2部分：表面贴装器件（SMD）的运输和储存条件 应用指南（IEC 61760-2:2007）

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007)

CEA-CEB19-2007 推荐扬声器安全守则

The properties of the Logical Units’ user interfaces originating from a physical device are available using the GET IPaddr/2027_file command, where the IPaddr is the IP address of the physical device in dotted decimal notation in ASCII. Service devices shall return an XML document, see [6], describing all device supported Logical Units as the concatenation of all Logical Unit block descriptions. The schemas for the 2027 file and opcodes in Annex B are informative.

Recommended Loudspeaker Safety Practices

BS EN 61760-2:2007 表面安装技术.表面安装设备(SMD)的运输和存储条件.使用指南

Surface mounting technology - Transportation and storage conditions of surface mounting devices (SMD) - Application guide

CEA-2013-A-2007 数字机顶盒的背景功率消耗

The properties of the Logical Units’ user interfaces originating from a physical device are available using the GET IPaddr/2027_file command, where the IPaddr is the IP address of the physical device in dotted decimal notation in ASCII. Service devices shall return an XML document, see [6], describing all device supported Logical Units as the concatenation of all Logical Unit block descriptions. The schemas for the 2027 file and opcodes in Annex B are informative.

Digital STB Background Power Consumption

DLA QPL-7990-16-2007 负70到300度电阻温度传递器

MIL-T-7990 was made "Inactive for New Design" with no superseding specification on 26 March 1999.

TRANSMITTER, TEMPERATURE, ELECTRICAL RESISTANCE, -70 DEG. TO +300 DEG. C

CEA-2015-2007 移动电子布线标准

This standard defines size and performance requirements for power and speaker cabling used in mobile electronics applications.

Mobile Electronics Cabling Standard

LST EN 60062-2005/AC-2007 电阻器和电容器的标记代码（IEC 60062:2004）

Marking codes for resistors and capacitors (IEC 60062:2004)