31.180 印制电路和印制电路板 标准查询与下载

BS PD IEC TR 62899-402-4:2021 印刷电子产品 可打印性 质量测量 形态学的分类和测量方法

Printed electronics. Printability. Measurement of qualities. Classification and measurement methods for morphology

EN IEC 61189-2-807:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 2-807 部分：互连结构材料的测试方法 使用 TGA 的分解温度（Td）

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

T/CPCA 6302-2021 挠性及刚挠印制电路板

本文件规定了挠性及刚挠印制电路板的分类、材料、性能要求、试验方法、检验规则、标识、包装、运输和贮存。 本文件适用于成品单面、双面、多层挠性及刚挠印制电路板。

Flexible and rigid-flexible printed circuit board

PN-EN IEC 61189-5-501-2021-10 E 电气材料、印制板和其他互连结构和组件的测试方法 第 5-501 部分：材料和组件的通用测试方法 助焊剂的表面绝缘电阻（SIR）测试（IEC 61189-5-501:202

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-501: General test methods for materials and assemblies -- Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:202

OVE EN IEC 61189-5-504:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-504 部分：材料和组件的通用测试方法 过程离子污染测试（PICT）（德文版）

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (german version)

IEC 62899-202-4:2021 印刷电子 第 202-4 部分：材料 导电油墨 可拉伸印刷层（导电和绝缘）特性的测量方法

This part of IEC 62899 defines the terminology and measurement methods for the properties of stretchable printed layers, such as conductive ink, for forming stretchable conductors by printing, stretchable conductive films obtained from conductive ink, and stretchable printed wiri

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

DIN EN IEC 62878-1:2021 器件嵌入组装技术-第1部分：器件嵌入基板的通用规范（IEC 62878-1:2019）；德文版 EN IEC 62878-1:2019

This part of IEC 62878 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019

IEC TR 62899-402-4:2021 印刷电子.第402-4部分:印刷适性.质量测量.形态分类和测量方法

Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology

IEC 61189-2-807:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 2-807 部分：互连结构材料的测试方法 使用 TGA 的分解温度（Td）

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

DS/EN IEC 62878-2-602:2021 器件嵌入组装技术《第2-602部分：堆叠式电子模块导则》《模块间电连接性评价方法》

Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity

BS EN IEC 62878-2-602:2021 设备嵌入组装技术 堆叠式电子模块指南 模块间电气连接性的评估方法

Device embedding assembly technology. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

BS PD IEC TR 62878-2-8:2021 设备嵌入组装技术 指导方针有源器件嵌入式衬底的翘曲控制

Device embedding assembly technology. Guidelines. Warpage control of active device embedded substrate

LST EN IEC 61189-5-301:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-301 部分：材料和组件的通用测试方法 使用细焊料颗粒的焊膏（IEC 61189-5-301:2021）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021)

GSO IEC 61189-2-719:2021 电气材料、印制板和其他互连结构和组件的测试方法 第2-719部分：互连结构材料的测试方法 相对介电常数和损耗角正切（500 MHz 至 10 GHz）

IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

GSO IEC 61249-2-42:2021 印刷板和其他互连结构的材料 第2-42部分：包覆和未包覆的增强基材 具有规定可燃性的溴化环氧无纺布/无纺布 E 玻璃增强层压板（垂直燃烧测试）、铜包层 .

IEC 61249-2-42:2010 gives requirements for properties of brominated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum.

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-cla...

GSO IEC 61191-6:2021 印制板组件 第6部分：BGA和LGA焊点空洞的评价标准和测量方法

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

GSO IEC TS 61189-3-301:2021 电气材料、印制板和其他互连结构和组件的试验方法 第3-301部分：互连结构（印制板）的试验方法 PWB电镀表面的外观检验方法

IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

GSO IEC PAS 61182-12:2021 印制板组装产品制造描述数据和传输方法的通用要求

IEC PAS 61182-2:2014(E) specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

GSO IEC 61189-5-3:2021 电气材料、印制板和其他互连结构和组件的测试方法 第5-3部分：材料和组件的通用测试方法 印制板组件的焊膏

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

GSO IEC TR 62878-2-2:2021 设备嵌入式基板 第2-2部分：指南 电气测试

IEC TR 62878-2-2:2015 describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.

Device embedded substrate - Part 2-2: Guidelines - Electrical testing