31.190 电子元器件组件 标准查询与下载

IPC PD-335 SECTION 3-1989 电子设备子系统

Electronic equipment subsystems deals with the enclosure and all internal structures and hardware used to package an electrical or electronic circuit. The enclosure and all of the internal substructures form an integral part of each piece of electronic hardware. Besides providing a mounting medium for all of the electrical and electronic circuitry it, in many instances, plays a major role in the functionality of hardware. It provides the capability for the electronics to be exposed to and survive the environments to which the hardware may be exposed during its operating life. The reliability and maintainability of a piece of electronic hardware along with its physical appearance will be determined by the design of the enclosure.

Electronic Equipment Subsystems

IPC PD-335 SECTION 1-1989 电子包装设计概述

This section deals with the issues related to Electronic Packaging Design and the automation tools necessary to accomplish and implement the appropriate design philosophy.

Electronic Packaging Design Overview

IPC D-859-1989 厚膜多层混合电路设计标准

Design Standard for Thick Film Multilayer Hybrid Circuits

Design Standard for Thick Film Multilayer Hybrid Circuits

ARMY MIL-S-63256 C-1987 M143(M143E1)型导弹安全和武装设备的逻辑电路混合器

This specificationes tablishes the performance, test, manufacture and accept ancer equirements for hybrid microcircuits, here in after to be called hybrids, to be used in the M143(M143E1) Safety and Arming(S&A) Device.

SAFETY AND ARMING DEVICE, GUIDED MISSILE: M143 (M143E1) LOGIC CIRCUIT HYBRID FOR

NF C90-540:1986 电子元件.总则.软焊元件用镀锡电线

Electronic components. General. Tinned wires for components for soft soldering.

IPC NC-349-1985 钻机和路由器的电脑数值控制格式化

This standard establishes the requirements, definitions, and certification provisions for optical inspection aids and defines inspection grades that can be used as accept/reject criteria for the instrumentation used in an inspection process that uses optical inspection aids.

Computer Numerical Control Formatting for Drillers and Routers

IPC MI-660 INTRO-1984 印制电路板材料的引入检查指导

The number and frequency of tests performed by the user will be at the usei's discretion. In this fashion, the user can provide himself with the necessary level of confidence he desires on incoming raw materials. Additionally, and because of this arrangement, testing can be performed at a level commensurate with the user's operations and capabilities.

Guidelines for Incoming Inspection of Printed Board Materials

IPC MI-660 6.4-1984 电解电镀化学品

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Electrolytic Plating Chemicals

IPC MI-660 7.4-1984 光电玻璃

This standard establishes requirements and other considerations

Photo Glass

IPC MI-660 9.4-1984 筛选材料,电线,布网

This Standard covers dimensioning and tolerancing of electronic packaging as it relates to printed boards and the assembly of printed boards. The concepts defined in this Standard are derived from ASME Y14.5” 1994. Printed boards have such wide applications that there may be times where this standard does not address a specific case. In those cases, the user is referred to ASME Y14.5M 1994 for use of additional dimensioning and tolerancing concepts.

Screening Materials, Wire, Cloth Mesh

IPC MI-660 10.1-1984 电镀阳极

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Plating Anodes

IPC MI-660 6.3-1984 电镀化学品

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

Electroless Plating Chemicals

IPC MI-660 5.3-1984 干电影光刻胶

IPC Standards and Publications are designed to serve the public interest through

Dry-Film Photoresist

IPC MI-660 3.5-1984 柔性电路粘接薄膜

IPC Standards and Publications are designed to serve the public interest through

Adhesive Bond Film, Flexible Circuit

IPC MI-660 3.3-1984 柔性电路胶包覆封面页

IPC Standards and Publications are designed to serve the public interest through

Adhesive-Coated Cover Sheet, Flexible Circuits

IPC MI-660 2.5-1984 集成电路添加剂无包壳层压板

IPC Standards and Publications are designed to serve the public interest through

Unclad Laminate, Additive Circuits

IPC MI-660 2.0-1984 印制电路板层板

IPC Standards and Publications are designed to serve the public interest throughIPC Standards and Publications are designed to serve the public interest through

Printed Board Laminates

IPC D-422-1982 新闻界适合刚性印制电路板底板设计指南

This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved.

Design Guide for Press Fit Rigid Printed Board Backplanes

SJ 20743-1999 散热器手册第1部分：热阻曲线集

本指导性技术文件规定了在自然冷却和强迫风冷条件下散热器的选用方法，给出了部分散热器的热阻特性曲线。 本指导性技术文件适用于电子设备中，有热耗散的电子元器件或模块用散热器。

Heat sink handbook Part 1:Thermal resistance curves

IPC 4554-2012 印刷电路板沉浸镀锡规格

This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).

Specification for Immersion Tin Plating for Printed Circuit Boards