31.200 集成电路、微电子学 标准查询与下载
共找到 3192 条与 集成电路、微电子学 相关的标准，共 213 页
Scope is not provided for this standard
Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers
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- 2014-12-25
- 实施
This part of IEC 60748 gives general information on integrated circuits. The object of this part of IEC 60748 is to provide information on the general principles or requirements applicable to the IEC 60748 series, which includes the standards for the various categories or sub-categories of integrated circuits.
Semiconductor devices - Integrated circuits - Part 1: General
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- 2014-12-25
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This part of IEC 60748 specifies a set of measuring methods and requirements for testing ADCs under dynamic conditions, together with associated terminology and characteristics.
Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
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- 31.200
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- 2014-12-25
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This part of the IEC 62433 series provides specifications for model-categories of EMC IC modelling, definitions of terms that are commonly used in IEC 62433 series, modelling approaches that can be used, and requirements for each modelling that is standardized in this series.
EMC IC modelling - Part 1: General modelling framework
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- 2014-12-25
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.(This publication forms part of the IEC Quality Assessment System for Electronic Components (IECQ This publication is a generic specification for semiconductor devices: discrete devices and integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. It defines general procedures for quality assessment to be used in the IECQ System and gives general rules for: measurement methods of electrical characteristics; climatic and mechanical tests; endurance tests. NOTE - This publication must be supplemented by the approved sectional, family and blank detail specifications, .where they exist, appropriate to the specific individual type or types
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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- 31.200
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- 2014-12-25
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
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- 2014-12-25
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Gives standards on the following sub-categories of analogue integrated circuits: -operational amplifiers (having two inputs and one output); -audio-amplifiers, video-amplifiers and multichannel amplifiers for telecommunications; -R.F. and I.F. amplifiers; -voltage and current regulators; -analogue signal switching circuits. Should be used with IEC 60747-1 and 60748-1.
Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
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- 31.200
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- 2014-12-25
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本规范规定了数字IP核交付的主要内容，包括文档、设计、验证、测试、模型等方面的交付内容。本规范可作为数字IP核转让时交付数据的主要依据。本规范适用于数字IP核的提供者、使用者和第三方评价IP核的适用性和复用性。此处第三方是指在IP核交易过程中进行认证和提供服务的独立机构。
IP core deliverables specification
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- 31.200
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- L56
- 发布
- 2014-10-14
- 实施
- 2015-04-01
本标准规定的是对IP核质量的主要方面，包括IP核的文档质量、IP核的设计质量、IP核的模型质量、IP核的功能验证质量、IP核的测试质量和硅验证质量等内容。本标准适用于IP核的提供者、IP核用户和第三方评价IP核的适用性和复用性。此处第三方是指在IP核交易过程中进行认证和提供服务的独立机构。
IP core quality evaluation
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- 31.200
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- L56
- 发布
- 2014-10-14
- 实施
- 2015-04-01
本标准规定了数字IP核相关文档结构方面的内容，包括IP核简介、功能规范、设计手册、功能及物理验证文档、测试手册和应用手册，是对IP核文档的基本要求。本标准适用于数字IP核的提供者组织撰写IP核相关文档、使用者和第三方评价IP核的文档质量。此处第三方是指在IP核交易过程中进行认证和提供服务的独立机构。
IP documentation guide
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- L56
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- 2014-10-14
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- 2015-04-01
Integrated circuits. Measurement of electromagnetic emissions. Measurement of radiated emissions. Surface scan metho
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- 31.200
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- L56
- 发布
- 2014-09-30
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- 2014-09-30
Integrated circuits. Measurement of electromagnetic immunity. Measurement of radiated immunity. Surface scan method
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- 31.200
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- L56
- 发布
- 2014-09-30
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- 2014-09-30
Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
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- 31.200
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- L56
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- 2014-08-01
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Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
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- 31.200
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- L56
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- 2014-08-01
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本标准规定了集成电路芯片相似性比对检验方法。本标准适用于集成电路芯片相似性比对,检验集成电路芯片设计的相似性。
Examination methods for similarity comparison of integrated circuit chips
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- 31.200
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- L56
- 发布
- 2014-07-09
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- 2014-07-09
本标准规定了硅单晶和硅单晶片单位产品能源消耗(以下简称能耗)限额的要求、计算原则、计算范围、计算方法和节能管理与措施。 本标准适用于硅单晶，包括半导体级硅单晶、太阳能级硅单晶；硅单晶片，包括半导体器件用硅单晶片和光伏太阳能电池用硅单晶片(以下统称硅片)生产企业产品能耗的计算、考核以及对新建项目的能耗控制。
Norm of energy consumption per unit products for monocrystalline silicon and silicon wafers
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- 31.200
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- L01
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- 2014-04-15
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- 2014-08-01
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method (IEC 62215-3:2013); German version EN 62215-3:2013
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- L56
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- 2014-04
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- 2014-04-01
IEC/TS 62132-9, Ed. 1: Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
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- 2014-01-01
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IEC/TS 61967-3, Ed. 2: Integrated Circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
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- 2014-01
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IEC/TR 62433-2-1:2010 covers black box modelling which has the potential to make the modelling of conducted emission very simple, very fast, and can provide complete protection of proprietary information of IC vendors. This technical report is intended to provide the theoretical background on black box modelling for IC conducted emission.
EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission
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- 31.200
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- 发布
- 2013-12-31
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