J00 标准化、质量管理 标准查询与下载

AWS D1.1-BI-2000 翻译官方书籍-收集关于AWS D1.1(1976-1998)正式要求的回应

During the process of welding, metal vapors are produced in the electric arc. As these vapors cool and solidi@, a fume is formed that may be a potential health hazard to the welder and to others working in the same area. Such fine aerosols are all irritating to the respiratory system. Yet some fumes may potentially be more dangerous than others because of the specific substances present.

The Official Book of D1.1 Interpretations - a Collection of Responses to Formal Inquiries About the Requirements of AWS D1.1 (1976-1998)

AWS PRGC-1999 焊点腐蚀的实践参考指南-成因和恢复

Subcommission XII–D of the International Institute of Welding, chaired by David Shackleton, initiated the task of assigning the designations for welding filler metals in 1984 and appointed R. David Thomas, Jr. as rapporteur.

The Practical Reference Guide for Corrosion of Welds - Causes and Cures

IPC TM-650 2.5.17-1998 印刷线路材料的体积电阻率和外部电阻 修订版E

This standard establishes requirements and other considerations

Volume Resistivity and Surface Resistance of Printed Wiring Materials Revision E

IPC TM-650 2.1.13-1998 夹杂物及孔洞在柔性印刷线路材料中的检验 修订版A

It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closer to meeting each others needs.

Inspection for Inclusions and Voids in Flexible Printed Wiring Materials Revision A

IPC TM-650 2.2.4-1998 弹性介质材料尺寸稳定性 修订版C

This standard provides the principles and details for declarations necessary between members of a supply chain. Although this standard contains only generic information regarding trading partners, when combined with a specific sectional standard, the entire document set is used to define and maintain the declaration type information. The requirements pertain to both hard copy and electronic data descriptions. This standard provides for the creation of a record that will serve as a commitment between trading partners and may be used to establish due diligence in any dispute in third-party litigation.

Dimensional Stability, Flexible Dielectric Materials Revision C

IPC TM-650 2.3.2-1998 柔性印刷线路材料的耐化学 修订版F

Users of this technical report are encouraged to participate in the development of future revisions.

Chemical Resistance of Flexible Printed Wiring Materials Revision F

IPC TM-650 2.6.2-1998 柔性印刷线路吸湿性能 修订版C

This document is intended to be a tool for a customer or supplier organization’s internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This document should be used by trained evaluators. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels.

Moisture Absorption, Flexible Printed Wiring Revision C

IPC TM-650 5.5-1998 插图 修订版B

This document is intended to provide the designeduser with information related to the use of pressure sensitive adhesives (PSA's) for assembly of flexible printed circuitdwiring (FF'CEPW) and membrane switches. This guide provides information on adhesive types available and processes suggested for their proper use, highlight.. strengths, weaknesses, or limitations; how to start implementation and where to find additional information.

Artwork Revision B

IPC TM-650 2.5.6.2-1998 印刷布线材料电气强度 修订版A

This specification covers mat made from nonwoven “E” glass fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.

Electric Strength of Printed Wiring Material Revision A

AIA/NAS NAS 1347-1998 Rev. 5阳性螺纹紧固件鉴定

The heads of fasteners are marked as specified for correct replacement,inspection, and general identification purposes.

Identification of Male Threaded Fasteners Rev 5

IPC TM-650 2.2-1998 三维测试方法 修订版I

Although the AQP is for a single site or location, information about the overall company is helpful in establishing the relationship of the existing site to the total company and to other sites or divisions. The first page of section 1 is intended to convey the overall company description and is reflected in the optional financial review detailed in section 8. The remainder of the AQP is devoted to information about a single site (see section 9 for examples).

Dimensional Test Methods Revision I

IPC TM-650 2.3-1998 化学试验方法 修订版Q

The reported results are based on the work done by the Copper Foil Ductility Round RobinTa sk Group, Werner Engelmaier, Chairman, under the auspices of the MetaFloliicl S ubcommittee of the Base Materials Committeeo f the Institute for Interconnecting and Packaging Electronic Circuits (IPC). qSTON, IL 60 1203- J

Chemical Test Mtheods Revision Q

IPC TM-650 2.5-1998 电气试验方法 修订版Q

This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Electrical Test Methods Revision Q

IPC TM-650 2.6-1998 环境试验方法 修订版P

The scope of this specification is to describe the methods of inspecting and cleaning all optical interfaces so that their interconnectivity does not result in loss of optical signal. It also describes methods of contamination prevention.

Environmental Test Methods Revision P

IPC TM-650 2.3.24.2-1997 铜基合金和镍(硝酸蒸汽试验)金属涂层的孔隙度 修订版A

This standard provides the principles and details for declarations necessary between members of a supply chain. Although this standard contains only generic information regarding trading partners, when combined with a specific sectional standard, the entire document set is used to define and maintain the declaration type information. The requirements pertain to both hard copy and electronic data descriptions. This standard provides for the creation of a record that will serve as a commitment between trading partners and may be used to establish due diligence in any dispute in third-party litigation.

Porosity of Metallic Coatings on Copper-Base Alloys and Nickel (Nitric Acid Vapor Test) Revision A

IPC TM-650 2.4.28-1997 焊面具(非熔融金属)粘附 修订版B

The data reproduced in this report is published for informational purposes only. It is based on data voluntarily contributed by members of the IPC. The IPC disclaims all liability of any kind for the use, application or adaptation of the material published in this document.

Adhesion, Solder Mask (Non-Melting Metals) Revision B

IPC TM-650 2.3.21-1997 镀质量赫尔槽法 修订版A

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

Plating Quality Hull Cell Method Revision A

IPC TM-650 2.2.1-1997 机械立体核查 修订版A

This Laminator Qualification Profile (LQP) isn't intended to satisfy all of the customer's requirements, however conscientious maintenance of this document and/or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paperwork, as vendors and suppliers work together to meeting each other’s needs.

Mechanical Dimensional Verification Revision A

IPC TM-650 2.2.2-1997 光学三维核查 修订版B

This standard establishes requirements and other considerations

Optical Dimensional Verification Revision B

IPC TM-650 2.2.5-1997 用微章节来进行三维检查 修订版A

This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for Electrical and Electronic Equipment (EEE). This standard applies to products, components, subitems and materials that are supplied to producers of EEE for incorporation into their products. It does not apply to packaging materials (e.g. cardboard, plastic tray). It covers materials and substances that may be present in the supplied product or subitem. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or subitem.

Dimensional Inspections Using Microsections Revision A