IEC 61249-2-51:2023
印制板和其他互连结构材料.第2-51部分:包覆和非包覆增强基材.非包覆集成电路卡载带基材
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
