The purpose of these tests is to check the internal materials, construction and workmanship of integrated circuits for compliance with the requirements of the applicable specification. These tests will normally be used prior to capping or encapsulation on a 100 % inspection basis to detect and eliminate devices with internal defects that could lead to device failure in normal application. They may also be employed on a sampling basis prior to capping to determine the effectiveness of the manufacturer's quality control and handling procedures for semiconductor devices.