ASTM B678-23由美国材料与试验协会 US-ASTM 发布于 2024-01-24。
ASTM B678-23在国际标准分类中归属于: 25.160.50 钎焊和低温焊。
ASTM B678-23 金属涂层产品可焊性的标准测试方法的最新版本是哪一版?
最新版本是 ASTM B678-23 。
1.1 This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold. 1.2 This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results, or both. Several are described in the literature.2 This is a “go-no-go” test and does not grade solderability as excellent, good, fair, and so forth. 1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
三、综合提升PCB镀层可焊性和抗环境侵蚀能力对改善工艺可靠性的现实意义(1)现在电子产品的制造质量越来越依赖于焊接质量。在焊接质量缺陷中占据第一位同时也是影响最严重的是虚焊,它是威胁电子产品工作可靠性的头号杀手。(2)虚焊现象成因复杂,影响面广,隐蔽性大,因此造成的损失也大。...
一、从可靠性的角度出发现代各类电子元器件引脚(电极)所用基体金属材料及其特性,以及在基体金属上所可能采取的各种抗腐蚀性及可焊性保护涂层材料的焊接性能,涂层在储存过程中发生的物理、化学反应,涂层的成分、致密性、光亮度、杂质含量等对焊接可靠性的影响,从而优选出抗氧化能力、可焊性、防腐蚀性最好的涂层,以及获得该涂层的最佳工艺条件,是确保焊接互连可靠性的重要因素之一。...
(2)焊盘涂层表面处理的最主要作用就是确保金属基底(通常是铜)的可焊性。由于以前的热风整平(HASL)焊盘涂层工艺存在缺点,可替代的表面涂层包括:有机可焊性保护膜(OSP)、Ni/Au、Ni/Pd/Au、Im-Sn和Im-Ag等。其中Ni/Au涂层又有ENIG Ni/Au和EG Ni/Au两种。无论选择哪种表面处理,它都必须维持精确的信号完整性,确保在任何情况下信号完整性都不会下降。...
图43.可焊性涂层的分类焊接过程是熔化的软钎料和被焊的基体金属结晶组织之间通过合金反应,将金属和金属结合在一起的过程。许多单金属或合金都可以和SnPb、SnAgCu等钎料发生冶金反应而生成IMC,从理论上讲,它们均可以作为可焊性镀层。按焊接时的熔化状态的不同,又可将其分成3类:(1)可熔镀层:焊接温度下镀层金属熔化,如Sn、Sn-Pb合金镀层等。...
Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号