EN 61189-5-3:2015 电气材料、印制板和其他互连结构和组件的试验方法 第 5-3 部分:材料和组件的通用试验方法 印制板组件用焊膏
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on ...