IEC 61760-2-2007
表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2-2007 发布历史
This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
IEC 61760-2-2007由国际电工委员会 IX-IEC 发布于 2007-04。
IEC 61760-2-2007 在中国标准分类中归属于: L10 电子元件综合，在国际标准分类中归属于: 31.020 电子元器件综合。
IEC 61760-2-2007 发布之时，引用了标准
- IEC 60286-3 自动搬运部件的包装.第3部分:连续胶带上表面安装部件的包装*， 2019-01-16 更新
- IEC 60286-4 自动装配用元件的包装.第4部分:封装在不同形式包装件中的电子元件用料盒*， 2013-07-01 更新
- IEC 60286-5 自动搬运部件的包装.第5部分:矩阵托盘*， 2018-04-25 更新
- IEC 60286-6 自动化处理用组件的包装.第6部分:表面安装组件的散装箱包装
- IEC 60721-3-1 环境条件分类 第3-1部分:环境参数组及其严酷程度的分类分级 贮存
* 在 IEC 61760-2-2007 发布之后有更新，请注意新发布标准的变化。
IEC 61760-2-2007的历代版本如下：
- 1998年02月 IEC 61760-2-1998 表面安装技术 第2部分:表面安装设备(SMD)的运输和存储条件 应用指南
- 2007年04月 IEC 61760-2-2007 表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南
- IEC 61760-2-2021 IEC 61760-2-2021
- 标准号
- IEC 61760-2-2007
- 发布日期
- 2007年04月
- 实施日期
- 废止日期
- 无
- 中国标准分类号
- L10
- 国际标准分类号
- 31.020
- 发布单位
- IX-IEC
- 引用标准
- IEC 60286-3 IEC 60286-4 IEC 60286-5 IEC 60286-6 IEC 60721-3-1
- 被代替标准
- IEC 91/569/CDV-2005 IEC 61760-2-1998
- 适用范围
- This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".