Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder
globule wetting balance method, applicable for surface mounting devices. These methods
determine quantitatively the solderability of terminations on surface mounting devices.
IEC 60068-2-54 is also available for surface mounting devices and should be consulted if
applicable.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method and are both applicable to components with metallic terminations and
metallized solder pads.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for
lead-free solder alloys.