IPC SMC-WP-002-1992
在电子组装中铅的使用评估

An Assessment of the Use of Lead in Electronic Assembly


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标准号
IPC SMC-WP-002-1992
发布日期
1992年08月01日
实施日期
废止日期
中国标准分类号
L10
国际标准分类号
31.190
发布单位
US-IPC
适用范围
Joining of conductors by soldering is one of the basic technologies in the assembly of electronic circuits. Solder provides mechanical strength. electrical continuity, and protection from the environment The most commonly used solder alloy for joining electronic components to copper conductors is Sn/Pb. either 60 weight percent Sn and 40 weight percent Pb, or the eutectic 63Sn/37Pb. The soldering systems based on these alloys have been highly developed and refined with decades of experience; much has been learned about the metallurgy. mechanical properties, flux chemistries, manufacturing protocols, and reliability. In electronic equipment assembly, soldering processes have been engineered to produce. at competitive costs. very small geometry joints approaching 75 microns in size. Manufacturing engineers, generally speaking, are extremely satisfied with SnPb solder, and are unlikely to welcome any change.




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