IPC SMC-WP-002-1992
在电子组装中铅的使用评估

An Assessment of the Use of Lead in Electronic Assembly

IPC SMC-WP-002-1992 发布历史

Joining of conductors by soldering is one of the basic technologies in the assembly of electronic circuits. Solder provides mechanical strength. electrical continuity, and protection from the environment The most commonly used solder alloy for joining electronic components to copper conductors is Sn/Pb. either 60 weight percent Sn and 40 weight percent Pb, or the eutectic 63Sn/37Pb. The soldering systems based on these alloys have been highly developed and refined with decades of experience; much has been learned about the metallurgy. mechanical properties, flux chemistries, manufacturing protocols, and reliability. In electronic equipment assembly, soldering processes have been engineered to produce. at competitive costs. very small geometry joints approaching 75 microns in size. Manufacturing engineers, generally speaking, are extremely satisfied with SnPb solder, and are unlikely to welcome any change.

IPC SMC-WP-002-1992由美国电子电路和电子互连行业协会 US-IPC 发布于 1992-08-01。

IPC SMC-WP-002-1992 在中国标准分类中归属于: L10 电子元件综合，在国际标准分类中归属于: 31.190 电子元器件组件。

IPC SMC-WP-002-1992的历代版本如下：

• 1992年08月01日 IPC SMC-WP-002-1992 在电子组装中铅的使用评估

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标准号

IPC SMC-WP-002-1992

发布日期

1992年08月01日

实施日期

废止日期

无

中国标准分类号

L10

国际标准分类号

31.190

发布单位

US-IPC

适用范围

Joining of conductors by soldering is one of the basic technologies in the assembly of electronic circuits. Solder provides mechanical strength. electrical continuity, and protection from the environment The most commonly used solder alloy for joining electronic components to copper conductors is Sn/Pb. either 60 weight percent Sn and 40 weight percent Pb, or the eutectic 63Sn/37Pb. The soldering systems based on these alloys have been highly developed and refined with decades of experience; much has been learned about the metallurgy. mechanical properties, flux chemistries, manufacturing protocols, and reliability. In electronic equipment assembly, soldering processes have been engineered to produce. at competitive costs. very small geometry joints approaching 75 microns in size. Manufacturing engineers, generally speaking, are extremely satisfied with SnPb solder, and are unlikely to welcome any change.