31.180 印制电路和印制电路板 标准查询与下载

GSO IEC PAS 62326-14:2013 印制板 - 第14部分：硬件底层基板 -可靠性术语/设计指南/

IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

KS C IEC 60249-3-3-2013 印刷电路用基材 第3部分：印刷电路连接用特殊材料 规范No.3：用于制造印刷电路板的永久性聚合物涂层材料（阻焊剂）

Base materials for printed circuits－ Part 3：Special materials used in connection with printed circuits－ Specification No.3：Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

KS C IEC 61188-5-3-2013 印制板和印制板组件 设计和使用 第5-3部分：连接（焊盘/接头）注意事项 两侧带有鸥翼引线的元件

Printed boards and printed board assemblies－Design and use－Part 5-3：Attachment(land/joint) considerations－Components with gull-wing leads on two sides

KS C IEC 61249-4-2-2013 印刷板和其他互连结构用材料 第4部分 2：未包层预浸料分规范 规定可燃性的多功能环氧编织无碱玻璃预浸料

Materials for printed boards and other interconnecting structures－Part 4－2：Sectional specification set for prepreg materials, unclad－Multifunctional epoxide woven E-glass prepreg of defined flammability

KS C IEC 60326-9-2013 印制板 第9部分：具有直通连接的柔性多层印制板规范

Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections

KS C IEC 60249-2-17-2013 印刷电路基材？第 2 部分：规格？规范 No.17：用于制造多层印刷板的具有规定可燃性的薄聚酰亚胺玻璃布覆铜层压板

Base materials for printed circuits?Part 2 : Specifications? Specification No.17 : Thin p.olyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

KS C IEC 61249-4-5-2013 印刷板和其他互连结构用材料 第4 5部分：未包层预浸料的分规范集 聚酰亚胺，改性或未改性，具有规定可燃性的编织无碱玻璃预浸料

Materials for printed boards and other interconnecting structures－Part 4－5：Sectional specification set for prepreg materials, unclad－Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

KS C IEC 61249-3-5-2013 印制板和其他互连结构用材料 第3-5部分：非增强基材、覆层和非覆层的分规范（适用于柔性印制板） 转移粘合膜

Material for printed boards and other interconnecting structures－Part 3-5：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Transfer adhesive films

KS C IEC 60249-2-19-2013 印刷电路用基材 第 2 部分：规格 规格第 19 号：用于制造多层印刷板的具有规定可燃性的薄双马来酰亚胺/三嗪改性环氧玻璃布覆铜层压板

Base materials for printed circuits-Part 2 : Specifications Specification No.19 : Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

KS C IEC 61249-4-11-2013 印刷板和其他互连结构用材料 第4 11部分：未包层预浸料分规范集 非卤化环氧化物、规定可燃性的编织无碱玻璃预浸料

Materials for printed boards and other interconnecting structures－Part 4－11：Sectional specification set for prepreg materials, unclad－Non-halogenated epoxide, woven E-glass prepreg of defined flammability

KS C IEC 61249-2-4-2013 印刷板和其他互连结构用材料 第2 4部分：增强基材，包覆和非包覆 规定可燃性的聚酯非织造/机织玻璃纤维层压板（垂直燃烧试验），铜包覆

Materials for printed boards and other interconnecting structures－Part 2－4：Reinforced base materials, clad and unclad－Polyester non-woven/woven fiberglass laminated sheet of defined flammability(vertical burning test), copper-clad

KS C IEC 60326-11-2013 印制板 第11部分：具有直通连接的刚柔结合多层印制板规范

Printed boards－Part 11：Specification for flex-rigidmultilayer printed boards with through connections

KS C IEC 61249-3-4-2013 印制板和其他互连结构用材料 第3 4部分：非增强基材、覆层和非覆层分规范（适用于柔性印制板） 涂有粘合剂的柔性聚酰亚胺薄膜

Materials for printed boards and other interconnecting structure－Part 3－4：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Adhesive coated flexible polyimide film

KS C IEC 61188-5-8-2013 印制板和印制板组件 设计和使用 第5-8部分：附件（焊盘/接头）注意事项 面阵元件（BGA、FBGA、CGA、LGA）

Printed board and printed board assemblies－Design and use－Part 5-8：Attachment(land/joint) considerations－Area array components(BGA, FBGA, CGA, LGA)

KS C IEC 61188-5-4-2013 印制板和印制板组件 设计和使用 第5-4部分：连接（焊盘/接头）注意事项 两侧带有J引线的元件

Printed boards and printed board assemblies－Design and use－Part 5-4：Attachment(land/joint) considerations－Components with J leads on two sides

KS C 6459-2013 多层印制线路板用半固化片的测试方法

TEST METHODS OF PREPREG FOR MULTILAYER PRINTED WIRING BOARDS

KS C IEC 60249-2-8-2013 印刷电路用基材 第2部分：规格 规格第8号：柔性覆铜聚酯（PETP）薄膜

Base materials for printed circuits－Part 2：Specifications－ Specification No.8：Flexible copper－clad polyester(PETP) film

KS C IEC 60249-2-9-2013 印刷电路用基材 第2部分：规格 规格第9号：环氧纤维素纸芯、环氧玻璃布表面规定可燃性的覆铜层压板（垂直燃烧试验）

Base materials for printed circuits－Part 2：Specifications－ Specification No.9：Epoxide cellulose paper core, epoxide glass cloth surfaces copper－clad laminated sheet of defined flammability(vertical burning test)

KS C IEC 60249-2-16-2013 印刷电路用基材 第2部分：规格 规格第16号：规定可燃性聚酰亚胺玻璃布覆铜层压板（垂直燃烧试验）

Base materials for printed circuits－Part 2：Specifications－ Specification No.16：Polyimide woven glass fabric copper-clad laminated sheet of defined flammability(vertical burning test)

KS C IEC 60326-8-2013 印制板 第8部分：具有直通连接的单面和双面柔性印制板规范

Printed boards－Part 8：Specification for single and double sidedflexible printed boards with through connections