31.190 电子元器件组件 标准查询与下载

DLA SMD-5962-90732-1994 硅单块 平衡混合器,直线型微型电路

W.Th is drawing forms a part of a one part - one part mnber docunentation system (see 6.6 herein). Two product assurance classes consisting of m i l i t a r y h i g h r e l i a b i l i t y (device classes P and M) and space application (&vice class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nunber (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, ~IProvisions for the use of MIL-STO-883 i n conjunction with conpliant non-JAN devicesm8. Uhen available, a choice of Radiation Herchess Assurance (RHA) levels are reflected in the PIN. 1.2 pIw. The PIN shall be as sham in the following exanple: 5r i 90732 T i T

MICROCIRCUIT, LINEAR, BALANCED MIXER, MONOLITHIC SILICON

IEC 60917-2-2:1994 电子设备用机械结构设计模型化规则 第2部分:分规范 25mm设备接口配合尺寸 第2节:详细规范 分机柜、机架、底板、前面板和插入单元尺寸

Is to be used in whole or in part in all fields of electronics where devices and systems are designed according to the sectional specification IEC 917-2. The purpose is the specification of dimensions which will ensure mechanical interchangeability (base

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface co-ordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks,

IEEE Std 1101.4-1993 IEEE 军用模块标准 格式 E 外形

This standard establishes the design requirements for a military module, format E form factor.

IEEE Standard for Military Module. Format E Form Factor

IEEE Std 1101.3-1993 传导冷却和风冷 10 SU 模块的 IEEE 机械标准

This standard establishes the mechanical design requirements for conduction-cooled and air-cooled modules of the 10SU by 6.375 inches (161.9 mm) format. This document is intended for use in conjunction with other IEEE standards.

IEEE Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules

IPC QE-615-1993 电子装配性评价手册

This handbook provides only titles of the individual photographs and illustrations. No comment as to the acceptability of the product based on the illustrations has been put forth, since what is acceptable for one product could be rejectable for another, excepting obvious situations.

Electronic Assembly Evaluation Handbook

IPC SMC-WP-002-1992 在电子组装中铅的使用评估

Joining of conductors by soldering is one of the basic technologies in the assembly of electronic circuits. Solder provides mechanical strength. electrical continuity, and protection from the environment The most commonly used solder alloy for joining electronic components to copper conductors is Sn/Pb. either 60 weight percent Sn and 40 weight percent Pb, or the eutectic 63Sn/37Pb. The soldering systems based on these alloys have been highly developed and refined with decades of experience; much has been learned about the metallurgy. mechanical properties, flux chemistries, manufacturing protocols, and reliability. In electronic equipment assembly, soldering processes have been engineered to produce. at competitive costs. very small geometry joints approaching 75 microns in size. Manufacturing engineers, generally speaking, are extremely satisfied with SnPb solder, and are unlikely to welcome any change.

An Assessment of the Use of Lead in Electronic Assembly

IEC 60917-2:1992 电子设备用机械结构设计模型化规则 第2部分:分规范 25mm设备接口配合尺寸

Specifies the co-ordination dimensions and pitches for cabinets, racks, subracks and chassis of all types used for electronic equipment in, e.g., industrial electronics, information technology, measurement and control systems and communications. The obje

Modular order for the development of mechanical structures for electronic equipment practices; part 2: sectional specification; interface co-ordination dimensions for the 25 mm equipment practice

IEC 60297-3/AMD1:1992 482.6mm(19 in)系列机械结构件的尺寸 第3部分:分机柜和相关插入单元.修改1

INTRODUCTION This amendment was prepared to follow up progress made by developments for the application of the 482.6 mm (19 in) series equipment practice) and by the standardization of further connector types application in the equipment practice.

Dimensions of mechanical structures of the 482,6 mm (19 in) series; part 3: subracks and associated plug-in units; amendment 1

IPC D-330 SECTION 10-1992 第10章印制电路板背板设计

The use of faster logic switching speeds and higher levels of integrated circuit functional integration are placing new demands on digital system interconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end-product development, fabrication, assembly, testing, and maintenance purposes.

Section Ten Printed Board Backplane Design

IPC D-330 SECTION 12-1992 第12章印制电路板文件

Whether a printed circuit is to be a prototype, or a high-volume product, there should be documentation describing all phases of the production process. However, exactly what should be documented and how it should be prepared is a serious consideration-especially if quality product is to be attainable within a given budget and schedule.

Section Twelve Printed Board Documentation

IPC D-330 SECTION 8-1992 第8章混合微电路和陶瓷印制电路板组件

Hybrid microelectronics and the use of ceramic printed boards represent viable approaches to electronic circuit packaging. As the term "hybrid" implies, this approach encompasses multiple technical disciplines which sometimes require compromises among process flow, component selection, and final package configuration. The purpose of this chapter is to present an overview of the hybrid microcircuit design procedure, to assist the design activity in the early identification of such compromises, as mentioned above, and to permit the selection of design and process alternatives that will emphasize the inherent advantages of this packaging technology.

Section Eight Hybrid Microcircuit and Ceramic Printed Board Assemblies

IPC D-330 SECTION 7-1992 第七章柔性印刷电路设计

Primarily because of its flat, thin shape, the use of flexible printed circuits can often give the designer optimum savings in weight, space, and cost. Depending on the specific application, a savings of up to 75% of packaging and interconnecting structure volume and weight are feasible.

Section Seven Flexible Printed Circuit Design

IPC D-330 SECTION 6-1992 第6章有机基刚性印制电路板设计

Rigid printed boards and printed board assemblies are generally subject to classifications by intended end item use. The IPC’s classification of producibility is related to complexity of the design and the precision required to produce the particular printed board or printed board assembly.

Section Six Organic-Base Rigid Printed Board Design

IPC D-330 SECTION 3-1992 第3章电脑辅助设计

This section of the Design Guide deals with the computeraided design (CAD) considerations of printed boards and assem blies.

Section Three Computer- Aided Design

SJ/T 10291-1991 不锈钢波导法兰盘

本标准规定了不锈钢普通矩形波导法兰盘、扁矩形波导法兰盘、中扁矩形波导法兰盘、方形波导法兰盘的总要求和尺寸、厚度以及检验方法。 本标准适用于低温电子学及超导电子学等领域用不锈钢波导法兰盘(简称法兰盘)。

Corrosion-resisting steel flanges for waveguide

ARMY MIL-S-63256 C (1)-1990 M143(M143E1)型导弹安全和武装设备的逻辑电路混合器

This amendment forms a part of Military Specification MIL-S-63256C(AR), dated 4 February 1987, and is approved for use within the US Army Armament Munitions and Chemical Command and is available for use by all Departments and Agencies of the Department of Defense.

SAFETY AND ARMING DEVICE, GUIDED MISSILE: M143 (M143E1) LOGIC CIRCUIT HYBRID FOR

IPC M-107 印制电路板材料手册标准

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Standards for Printed Board Materials Manual

IPC MI-660 SECTION 2 印制电路板层板

Printed Board Laminates

Printed Board Laminates

IPC TA-721 EPIC 外部集成电路

This document provides guidelines for accelerated reliability

Epic

JIS C 0805:1989 电子元器件的包装(横引线和纵引线元器件)

Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)