31.200 集成电路、微电子学 标准查询与下载

LST EN 61967-6-2003/A1-2008 集成电路 电磁辐射测量，150 kHz 至 1 GHz 第6部分：传导辐射测量 磁探针法（IEC 61967-6:2002/A1:2008）

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002/A1:2008)

DIN EN 61967-6:2008 集成电路.频率为150kHz～1GHz的电磁辐射的测量.第6部分:传导辐射的测量.探磁针方法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002 + A1:2008); German version EN 61967-6:2002 + A1:2008

BS IEC 60748-2-20:2008 半导体器件.集成电路.数字集成电路.类规范.低压集成电路

Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits

IEC 60747-1:2006/COR1:2008 半导体装置.第1部分:总则.技术勘误1

Semiconductor devices - Part 1: General; Corrigendum 1

DS/EN 61967-6/A1:2008 集成电路 电磁发射的测量，150 kHz 至 1 GHz 第6部分：传导发射的测量 磁探针法

Specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz.

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

IEC 61967-6:2002+AMD1:2008 CSV 集成电路.150kHz至1GHz电磁发射的测量.第6部分:传导发射的测量.磁探针法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

IEC 61967-6:2002/AMD1:2008 集成电路.150kHz至1GHz电磁发射的测量.第6部分:传导发射的测量.磁探针法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

LST EN 62132-3-2008 集成电路 电磁抗扰度测量，150 kHz 至 1 GHz 第3部分：大电流注入（BCI）方法（IEC 62132-3:2007）

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007)

DIN EN 62132-3:2008 集成电路.150kHz～1GHz电磁兼容性的测量.第3部分:大容量电流注入(BCI)法(IEC 62132-3-2007)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007); German version EN 62132-3:2007

DS/EN 62132-3:2008 集成电路 电磁抗扰度的测量，150 kHz 至 1 GHz 第3部分：大电流注入（BCI）方法

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires.This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

IEC 60748-2-20:2008 半导体器件.集成电路.第2-20部分:数字集成电路.系列规范.低压集成电路

This standard aims at giving DC interface specifications for various sets of values, where each comprises the nominal value of power supply voltage, its tolerance, and the worst-case limit values of the input and output voltages for low voltage integrated circuits. It also provides two categories of interface specification for each nominal supply voltage – normal range and wide range. The normal range is based on the nominal industry standard with typical tolerance of about 10 %. The wide range covers battery operation that extends the lower limit to a practical value at which the battery will continue to operate.

Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

NF C96-261-3:2008 集成电路.150KHz～1GHz电磁抗扰度的测量.第3部分:大容量电流注入(BCI)法

Integrated circuits - Measurement of electromagnetic immunity, 150 KHz to 1 GHz - Part 3 : Bulk Current Injection (BCI) method.

IEC 61967-6:2008 集成电路.150kHz至1GHz电磁发射的测量.第6部分:传导发射的测量.磁探针法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

IEEE 605-2008 空气绝缘技变电站中的母线设计指南

Guide for Bus Design in Air Insulated Substations

BS IEC 62528:2007 嵌入式基于芯片的集成电路的标准可试性方法

Standard testability method for embedded core-based integrated circuits

DD IEC/TS 62215-2:2007 集成电路 脉冲抗扰度的测量-同步瞬态注入法

What is DD IEC/TS 62215-2 - Immunity of integrated circuits about?  Integrated circuits are globally popular in most electronic devices like automobiles, watches, microwave ovens, computers, televisions, traffic lights etc. DD IEC/TS 62215-2 is a technical specification that contains general information and definitions on the test method to evaluate the immunity of integrated circuits against fast conducted synchronous transient disturbances. DD IEC/TS 62215-2 also contains a description of measurement conditions, test equipment and test set-up as well as the test procedures and the requirements on the content of the test report. The objective of DD IEC/TS 62215-2   is to describe general conditions to obtain a quantitative measure of immunity of integrated circuits establishing a uniform testing environment. DD IEC/TS 62215-2   describes the critical parameters that are expected to influence the test results. Deviations from this specification should be explicitly noted in the individual test report. Who is DD IEC/TS 62215-2 - Immunity of integrated circuits for?   BS EN DD IEC/TS 62215-2 on the immunity of integrated circuits is useful for:  Manufacturer of electronic equipment and components

Integrated circuits. Measurement of impulse immunity - Synchronous transient injection method

BS DD IEC/TS 62215-2:2007 集成电路.脉冲抗扰度的测量.同步瞬时注射法

IEC/Ts 62215-2，which is a technical specification，contains general information and definitions on the test method to evaluate the immunity of integrated circuits(ICs)against fast conducted synchronous transient disturbances．This information is followed by a description of measurement conditions，test equipment and test set—up as well as the test procedures and the requirements on the content of the test report． the objective of this technical specification is to describe general conditions to obtain a quantitative measure of immunity of ICs establishing a uniform testing environment．Critical parameters that are expected to influence the test results are described．Deviations from this specification should be explicitly noted in the individual test report． this synchronous transient immunity measurement method，as described in this specification． uses short impulses with fast rise times of different amplitude，duration and polarity in a conductive mode to the IC．In this method，the applied impulse should be synch ronized with the activity of the IC to make sure that controlled and reproducible conditions can be assured．

Integrated circuits - Measurement of impulse immunity - Synchronous transient injection method

BS EN 62132-3:2007 集成电路.150 kHz～1 GHz电磁抗扰性的测量.大容量电流注入(BCI)法

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) method

IEC 62528:2007 嵌入式基于芯片的集成电路用标准可试性方法

IEEE Std 1500 has developed a standard design-for-testability method for integrated circuits (ICs) containing embedded nonmergeable cores. This method is independent of the underlying functionality of the IC or its individual embedded cores. The method creates the necessary requirements for the test of such ICs, while allowing for ease of interoperability of cores that may have originated from different sources.

Standard testability method for embedded core-based integrated circuits

IEC 60747-16-2:2001/AMD1:2007 半导体器件.第16-2部分:微波集成电路.频率预定标器

This standard is Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers; Amendment 1.

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers; Amendment 1