L40 半导体分立器件综合 标准查询与下载

DLA SMD-5962-85097 REV F-2005 硅单块 多路复用器高级低功率肖脱基晶体管-晶体管逻辑电路,双极数字微型电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, MULTIPLEXERS, MONOLITHIC SILICON

DLA SMD-5962-85511 REV D-2005 硅单块 带三态输出总线接收器晶体管-晶体管逻辑电路,高级肖脱基,双极数字微型电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, BUS TRANSCEIVERS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON

DLA SMD-5962-85508 REV C-2005 硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY, TTL, MULTIPLEXER, MONOLITHIC SILICON

IEC 62258-1:2005 半导体压模产品.第1部分:采购和使用的要求

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. This standard covers the specific requirements for data needed to describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also contains, in Annexes A and B, terminology and a list of common acronyms, respectively.

Semiconductor die products - Part 1: Requirements for procurement and use

DLA SMD-5962-95763 REV E-2005 高速抗辐射互补金属氧化物半导体,可设置双重D双稳态多谐振荡器,晶体管兼容输入硅单片电路线型微电路

This drawing documents three product assurance class levels consisting of high reliability (device classes Q andM), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class T, the user is encouraged to review the manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended application.

MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS, DUAL D FLIP-FLOP WITH SET AND RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

DLA SMD-5962-91738 REV A-2005 硅单块 八进制D型改进型肖特基晶体管晶体管逻辑电路,双极数字微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, OCTAL D-TYPE, MONOLITHIC SILICON

DLA SMD-5962-96521 REV B-2005 抗辐射互补金属氧化物半导体三重3输入晶体管兼容硅单片电路线型微电路

Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).

MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, TRIPLE 3-INPUT NAND GATE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

DLA SMD-5962-96523 REV B-2005 抗辐射互补金属氧化物半导体三重3输入晶体管兼容硅单片电路线型微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, TRIPLE 3-INPUT AND GATE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

IEEE 1450.1-2005 半导体设计环境用标准测试接口语言的扩展(STIL)(IEEE Std 1450-1999)

Standard Test Interface Language (STIL) provides an interface between digital test generation tools and test equipment. Extensions to the test interface language are defined that a) facilitate the use of the language in the design environment and b) facilitate the use of the language for large designs encompassing sub-designs with reusable patterns.

IEEE Standard for Extensions to Standard Test Interface Language (STIL) (IEEE Std 1450?999) for Semiconductor Design Environments IEEE Computer Society Document; Errata:12/20/2005

NF C96-022-30*NF EN 60749-30:2005 半导体器件.机械和气候试验方法.第30部分:可靠性试验之前不气密的表面安装器件的预调试

Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing.

IEC 62258-2:2005 半导体压模产品.第2部分:交换数据格式

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the da

Semiconductor die products - Part 2: Exchange data formats

IEC TR 62258-3:2005 半导体压模产品.第3部分:搬运、包装和储存的良好实施规程建议

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - singulated bare die, - minimally or partially encapsulated die and wafers. This report contains suggested good practice for

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

DLA SMD-5962-87556 REV D-2005 硅单块 晶体管-晶体管逻辑电路兼容输入,带三态输出八进制透明止动销,高级互补金属氧化物半导体数字微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL TRANSPARENT LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

DLA SMD-5962-96773 REV C-2005 互补金属氧化物半导体,八角触发D类三状态输出双稳态多谐振荡器,晶体管兼容输入硅单片电路数字微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON

DLA SMD-5962-87553 REV B-2005 硅单块 晶体管-晶体管逻辑电路兼容输入,双4选1译码器或多路分解器,高级互补金属氧化物半导体数字微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, DUAL 1-OF-4 DECODER/DEMULTIPLEXER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

DLA DSCC-DWG-04030-2005 2N5926高功率型,硅NPN晶体管半导体器件

This drawing describes the requirements for NPN, silicon, high-power transistors.

SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH POWER TYPE 2N5926

NF C96-013-6:2005 半导体器件的机械标准化.第6部分:表面安装半导体器件封装轮廓图绘制的一般规则

Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages.

DLA SMD-5962-87631 REV C-2005 硅单块 带三态输出和晶体管-晶体管逻辑电路兼容输入的八进制D型双稳态多谐振荡器触发电路,高级互补金属氧化物半导体,数字微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL D-TYPE FLIP-FLOP, TTL COMPATIBLE INPUTS, THREE-STATE OUTPUTS, MONOLITHIC SILICON

BS EN 60191-6:2004 半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则

This part of IEC 60191 gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surface-mounted devices-discrete semiconductors as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.

Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages

BS EN 60191-6:2005 半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则

This part of IEC 60191 gives general rules for the preparation of outlines drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surfacemounted devices-discrete semiconductors as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages