IEC TR 62258-7:2007
半导体压模产品.第7部分:数据交换用可扩展标记语言(XML)计划

Semiconductor die products - Part 7: XML schema for data exchange

标准号

IEC TR 62258-7:2007

发布

2007年

发布单位

国际电工委员会

当前最新

IEC TR 62258-7:2007

 

 

引用标准

IEC 60050 IEC 62258-1 IEC 62258-2 IEC 62258-5 IEC 62258-6 IEC/TR 62258-4

适用范围

IEC/TR 62258-7, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

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