IEC/TR 62258-7, which is a technical report, has been developed to facilitate the production,
supply and use of semiconductor die products, including:
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This report contains an XML schema that describes the elements needed for data exchange
and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and
IEC 62258-6, as well as providing an exchange structure that is complementary to those
defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in
IEC/TR 62258-4.