IPC TM-650 2.5.17.2-1998
两线方法,高密度互连(HDI)和微通孔设计指南导电材料的体积电阻
Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method
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- 标准号
- IPC TM-650 2.5.17.2-1998
- 发布
- 1998年
- 发布单位
- 美国电子电路和电子互连行业协会
- 适用范围
- This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent of this specification is to allow the Printed Board user and supplier flexibility to develop optimum procedures for the Manufacture and Procurement of Printed Boards.