IPC TM-650 2.5.17.2-1998
两线方法,高密度互连(HDI)和微通孔设计指南导电材料的体积电阻

Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method

非常抱歉，我们暂时无法提供预览，您可以试试： 免费下载 IPC TM-650 2.5.17.2-1998 前三页，或者稍后再访问。

注意： 点击下载后，生成下载文件时间比较长，请耐心等待......

标准号

IPC TM-650 2.5.17.2-1998

发布日期

1998年

实施日期

废止日期

无

中国标准分类号

G39

国际标准分类号

83.180

发布单位

US-IPC

适用范围

This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent of this specification is to allow the Printed Board user and supplier flexibility to develop optimum procedures for the Manufacture and Procurement of Printed Boards.