IEC TR 62258-8:2008
半导体压模产品.第8部分:数据交换用描述(EXPRESS)模型图解

Semiconductor die products - Part 8: EXPRESS model schema for data exchange


IEC TR 62258-8:2008




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标准号
IEC TR 62258-8:2008
发布
2008年
发布单位
国际电工委员会
当前最新
IEC TR 62258-8:2008
 
 
引用标准
IEC 60050 IEC 62258-1 IEC 62258-2 IEC 62258-5 IEC 62258-6 IEC/TR 62258-4 ISO 10303-11:2004 ISO 10303-21:2002
适用范围
This part of IEC62258, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including ~ wafers, ~ singulated bare die, ~ die and wafers with attached connection structures, ~ minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC62258-1, IEC62258-5 and IEC62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

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