This part of IEC62258, which is a technical report, has been developed to facilitate the
production, supply and use of semiconductor die products, including
~ wafers,
~ singulated bare die,
~ die and wafers with attached connection structures,
~ minimally or partially encapsulated die and wafers.
This Technical Report contains an EXPRESS model schema that describes the elements
needed for data exchange and that will allow the implementation of the requirements of the
IEC62258-1, IEC62258-5 and IEC62258-6 standards, as well as providing an exchange
structure that is complementary to those defined in IEC 62258-2. It is also complementary to
and compatible with the questionnaire in IEC 62258-4.