IEC/TR 62258-8-2008
半导体压模产品.第8部分:数据交换用描述(EXPRESS)模型图解

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

IEC/TR 62258-8-2008 发布历史

This part of IEC62258, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including ~ wafers, ~ singulated bare die, ~ die and wafers with attached connection structures, ~ minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC62258-1, IEC62258-5 and IEC62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

IEC/TR 62258-8-2008由国际电工委员会 IX-IEC 发布于 2008-05。

IEC/TR 62258-8-2008 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080.01 半导体器分立件综合。

IEC/TR 62258-8-2008 发布之时，引用了标准

• IEC 60050 修改件3.国际电工词汇（IEV）.第904部分:电气和电子产品及系统的环境标准化*， 2019-10-17 更新
• IEC 62258-1 半导体压模产品.第1部分:采购和使用*， 2009-04-01 更新
• IEC 62258-2 半导体压模产品.第2部分:交换数据格式*， 2011-05-01 更新
• IEC/TR 62258-4 半导体压模产品.第4部分:压模用户和供应商调查表*， 2012-08-01 更新
• IEC 62258-5 半导体压模产品.第5部分:关于电子模拟的信息要求
• IEC 62258-6 半导体压模产品.第6部分:关于热模拟的信息要求
• ISO 10303-11-2004 工业自动化系统和集成.产品数据表示和交换.第11部分:描述方法:EXPRESS语言参考手册
• ISO 10303-21-2002 工业自动化系统和集成.产品数据表示和交换.第21部分:实现方法:产品交换结构的正文编码

* 在 IEC/TR 62258-8-2008 发布之后有更新，请注意新发布标准的变化。

IEC/TR 62258-8-2008的历代版本如下：

• 2008年05月 IEC/TR 62258-8-2008 半导体压模产品.第8部分:数据交换用描述(EXPRESS)模型图解

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标准号

IEC/TR 62258-8-2008

发布日期

2008年05月

实施日期

废止日期

无

中国标准分类号

L40

国际标准分类号

31.080.01

发布单位

IX-IEC

引用标准

IEC 60050 IEC 62258-1 IEC 62258-2 IEC/TR 62258-4 IEC 62258-5 IEC 62258-6 ISO 10303-11-2004 ISO 10303-21-2002

适用范围

This part of IEC62258, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including ~ wafers, ~ singulated bare die, ~ die and wafers with attached connection structures, ~ minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC62258-1, IEC62258-5 and IEC62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

IEC/TR 62258-8-2008系列标准

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