31.180 印制电路和印制电路板 标准查询与下载

GSO IEC 61188-7:2015 印制板和印制板组件 设计和使用 第7部分：电子元件的零布线以创建计算机辅助设计 (CAD) 规范

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

GSO IEC 62326-4-1:2015 印制板 第4部分：具有层间连接的多层印刷刚性板 分规范 第1部分：详细容量规范 性能水平 (a)、(b) 和 (c)

This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interlayer connections manufactured with materials specified in 3.1. It specifies the capability qualifying component (CQC), the characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing capability for performance level A, B or C.

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

GSO IEC 61189-2:2015 电气材料、印刷板和其他互连组件和配件的测试方法 第2部分：互连结构材料的测试方法

This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

GSO IEC 62326-4:2015 印制板 - 第4部分：带互连的刚性多层印制板 -分规范

This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for the printed boards intended to be accepted under the IEC Quality Assessment System for Electronic Components (IECQ). This standard establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance (whether by lot-by-lot inspection, process control, or periodic inspection).

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

EN 62878-1-1:2015 器件嵌入式基板 第 1-1 部分：通用规范 测试方法

IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

Device embedded substrate - Part 1-1: Generic specification - Test methods

LST EN 61189-5-4-2015 电气材料、印制板和其他互连结构和组件的测试方法 第 5-4 部分：材料和组件的通用测试方法 用于印制板组件的焊料合金和助焊剂和非助焊剂实心线（IEC

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC

BS EN 61189-2-721:2015 电气材料, 印制板和其他互连结构和组合装置的试验方法. 互连结构材料试验方法. 采用分离介质谐振器在微波频率下测量覆铜层压板的相对介电常数和损耗角正切

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwa

EN 61189-2-721:2015 电气材料、印制板和其他互连结构和组件的测试方法 第 2-721 部分：互连结构材料的测试方法 覆铜板的相对介电常数和损耗角正切的测量

IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin

SJ/T 2354-2015 PIN、雪崩光电二极管测试方法

本标准规定了PIN、雪崩光电二极管(以下简称“二极管”)光电参数的测试方法。

Measuring methods for photodiodes of PIN、APD

SJ/T 11534-2015 微波电路用覆铜箔聚四氟乙烯玻纤布层压板

本标准规定了微波电路用覆铜箔聚四氟乙烯玻纤布层压板(以下简称覆铜板)的分类、各项技术要求、检验方法、检验规则、标志、包装、储存及运输要求。本标准适用于E玻纤布渍聚四氟乙烯乳液,经烘干、烧结成的聚四氟乙烯预浸料,单面或双面覆铜箔热压制成的覆铜箔层压板。未覆箔层压板也可参照使用。

Copper-clad PTFE woven glass fabric laminate for microwave circuit

EN 61189-5-4:2015 电气材料、印制板和其他互连结构和组件的测试方法 第 5-4 部分：材料和组件的通用测试方法 用于印制板组件的焊料合金和助焊剂和非助焊剂实心焊丝

IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

EN 61189-5-2:2015 电气材料、印制板和其他互连结构和组件的试验方法 第 5-2 部分：材料和组件的通用试验方法 印制板组件用助焊剂

IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

EN 61189-5-3:2015 电气材料、印制板和其他互连结构和组件的试验方法 第 5-3 部分：材料和组件的通用试验方法 印制板组件用焊膏

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

IEC 60050-541:1990/AMD1:2015 修改件1.国际电工词汇.第541部分:印刷电路

Amendment 1 - International Electrotechnical Vocabulary - Part 541: Printed circuits

BS EN 61189-5-3:2015 电气材料、印刷板和其他互连结构和组件的测试方法 材料和组件的通用测试方法 用于印刷板组件的焊膏

What is BS EN 61189-5-3 - Soldering paste for printed board assemblies about?     BS EN 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the EN 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.  BS EN 61189-5-3 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions.    BS EN 61189-5-3 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. BS EN 61189-5-3 focuses on test methods for soldering paste based on the existing EN 61189-5 and EN 61189-6 . In addition, it includes test methods of soldering paste for lead-free soldering. Who is BS EN 61189-5-3 - Soldering paste for printed board assemblies for?    BS EN 61189-5-3 on soldering paste for printed board assemblies is relevant to:   Manufacturers of electronic devices   Manufacturers of printed circuits and boards   Quality testing agencies  Electronics industry 

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste for printed board assemblies

BS IEC 61189-5-2:2015 电气材料、印刷电路板和其他互连结构和组件的试验方法 材料和组件的通用试验方法 印制板组件用助焊剂

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies

BS EN 61189-5-4:2015 电气材料、印刷板和其他互连结构和组件的测试方法 材料和组件的通用测试方法 用于印刷板组件的焊料合金以及助焊剂和非助焊剂实心焊丝

What is BS EN 61189-5-4 - T est methods for materials and assemblies about?    Printed board assemblies are used in almost every electronic product to mechanically support and electrically connect electronic components. BS EN 61189-5-4 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.   BS EN 61189-5-4 focuses on test methods for solder alloys, fluxed and non-fluxed solid   wire, based on existing IEC 61189-5 and IEC 61189-6 . In addit...

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

BS IEC 61189-5-3:2015 电气材料、印刷电路板和其他互连结构和组件的试验方法 材料和组件的通用试验方法 印制板组件用焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies

BS IEC 61189-5-4:2015 电气材料、印刷电路板和其他互连结构和组件的试验方法 材料和组件的通用试验方法 印制板组件用焊料合金和助焊剂和非助焊剂实心线

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblie

BS EN 61189-5-2:2015 电气材料、印刷板和其他互连结构和组件的测试方法 材料和组件的通用测试方法 用于印刷板组件的助焊剂

What is BS IEC 61189-5-2 - Soldering flux for printed board assemblies about?       BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. electrical materials printed board and other interconnection structures and assemblies  are a laminated sandwich structure of conductive and insulating layers. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.    BS IEC 61189-5-2 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions. 

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering flux for printed board assemblies